Conductive Gasket Structure for Heat Transfer and EMI Shielding

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Solution Overview

Problem

Conventional electrically conductive foams and fabric-over-foam gaskets exhibit poor thermal transfer performance, necessitating the development of gaskets that can effectively combine electrical conductivity, thermal conductivity, compressibility, and resilience.

Innovation Solution

The proposed solution involves a gasket design that includes a resilient core, a heat spreader such as graphite wrapped around the core, and an electrically conductive layer like copper covering the heat spreader, creating both electrical and thermal conductive paths.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional electrically conductive foams and fabric-over-foam gaskets are used, then electrical conductivity is achieved, but thermal transfer performance is poor

Engineering Contradiction:
Improvethermal transfer performanceVSAvoidelectrical conductivity
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent applies composite materials by combining a resilient foam core with a heat spreader layer (graphite or metal) and an electrically conductive outer layer (metal fabric or foil). This multi-layer composite structure integrates thermal conduction through the heat spreader layer with electrical conduction through the outer conductive layer, while the foam core provides compression and resilience. The composite design resolves the contradiction by allowing each layer to specialize in its primary function.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The gasket is segmented into distinct functional layers: an inner resilient core for mechanical compression, a middle heat spreader layer for thermal conduction, and an outer electrically conductive layer for electrical grounding and EMI shielding. This segmentation allows each layer to optimize its specific function without compromising the others, enabling simultaneous achievement of thermal and electrical conductivity.

Inventive Principle:
Principle #1Segmentation

2Reliability

If a multi-layer structure with heat spreader and conductive layer is used, then thermal and electrical conductivity are improved, but device complexity increases

Engineering Contradiction:
Improvethermal and electrical conductivityVSAvoidgasket structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple functions (thermal conduction, electrical conduction, compression, and EMI shielding) into a single integrated gasket component. By combining the heat spreader layer with the electrically conductive outer layer in one assembly, the design eliminates the need for separate thermal interface materials and fabric-over-foam gaskets, thereby reducing overall device complexity despite the multi-layer construction.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The gasket is designed as a universal multi-functional component that simultaneously provides mechanical compression (through the foam core), thermal conduction (through the heat spreader), electrical conduction (through the outer conductive layer), and EMI shielding. This multi-functionality reduces the total number of components needed in the device assembly.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances electrical and thermal characteristics, achieving a maximum compression ratio, low Z-axis electrical resistance, high shielding effectiveness, and improved thermal conductivity, thereby replacing the need for separate thermal interface materials and fabric-over-foam gaskets.

Implementation Method 1

a heat spreader disposed along at least two sides of the plurality of sides of the resilient core

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an electrically conductive layer disposed along and/or covering at least a portion of the heat spreader, such that the portion of the heat spreader is between the resilient core and the electrically conductive layer

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

The gasket is positionable and/or compressible between first and second surfaces to thereby define an electrically conductive path and a thermally conductive path between the first and second surfaces

Methodology Applied
Scientific EffectCompression: Compression

Data Source

PatentUS12209664B2Electrically and thermally conductive gaskets
Publication Date: 2025.01.28 LAIRD TECHNOLOGIES (SHENZHEN) CO LTD
  • US12209664B2 patent drawing
  • US12209664B2 patent drawing
  • US12209664B2 patent drawing

AI summary

An electrically and thermally conductive gasket includes a resilient core including a plurality of sides, a heat spreader disposed along at least two sides of the plurality of sides of the resilient core, and an electrically conductive layer disposed along and/or covering at least a portion of the heat spreader, such that the portion of the heat spreader is between the resilient core and the electrically conductive layer. The gasket is positionable and/or compressible between first and second surfaces to thereby define an electrically conductive path and a thermally conductive path between the first and second surfaces.