Conductive Gasket Grounding for Optoelectronic Modules

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Optoelectronic modules face challenges with electromagnetic interference (EMI) due to electromagnetic radiation and difficulties in accurately securing components within limited space, leading to unreliable grounding.

Innovation Solution

The implementation of volumetric electrical grounding through conductive gaskets that provide direct physical contact over a large surface area, surrounding the optical subassembly, to reduce electromagnetic radiation and enhance component securing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If single point or few points of electrical grounding is used, then device complexity is reduced, but electromagnetic radiation increases

Engineering Contradiction:

Improvegrounding structure complexityVSAvoidelectromagnetic radiation

Core Design Contradiction:

Device complexityVSObject-generated harmful factors

Solution Approach 1:

The patent transitions from point-based grounding (0D) to surface-based volumetric grounding (2D/3D) by using conductive gaskets that contact the OSA housing at multiple distributed points across large surface areas of the top and bottom shells, fundamentally changing the grounding dimensionality to reduce electromagnetic radiation

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Object-generated harmful factors

If volumetric electrical grounding with conductive gaskets is used, then electromagnetic radiation decreases, but device complexity increases

Engineering Contradiction:

Improveelectromagnetic radiationVSAvoidgrounding structure complexity

Core Design Contradiction:

Object-generated harmful factorsVSDevice complexity

Solution Approach 1:

The conductive gasket serves as an intermediary component between the OSA housing and the module shells, providing volumetric grounding without requiring direct complex integration. The gasket mediates the electrical connection while simplifying assembly and maintaining manufacturability

Inventive Principle:

Principle #24Intermediary (Mediator)

3Volume of moving object

If components are secured in limited space, then module size is reduced, but manufacturing precision requirements increase

Engineering Contradiction:

Improvemodule sizeVSAvoidcomponent securing accuracy

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent changes the grounding contact parameters from point contacts to distributed surface contacts through compressible conductive gaskets. This allows accommodation of manufacturing and thermal tolerances while maintaining reliable electrical connection, reducing the precision requirements for component positioning

Inventive Principle:

Principle #35Parameter changes

4Ease of manufacture

If point grounding is used, then assembly is simpler, but grounding reliability decreases

Engineering Contradiction:

Improveassembly simplicityVSAvoidgrounding reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The grounding system is segmented into multiple distributed contact points through the conductive gasket rather than relying on a single grounding point. This segmentation provides redundant grounding paths, improving reliability while maintaining assembly simplicity through the use of pre-fabricated gasket components

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly decreases electromagnetic radiation and improves component grounding reliability, minimizing EMI and addressing assembly challenges by compensating for manufacturing and thermal tolerances.

Implementation Method 1

a top OSA surface configured to make direct physical contact with a conductive housing of an OSA; a bottom OSA surface configured to be in direct physical contact with the conductive housing of the OSA

Methodology Applied

Scientific EffectElectrical Conduction: Conduction (electrical)

Data Source

PatentUS8267599B2Optical subassembly grounding in an optoelectronic module

Publication Date: 2012.09.18 II VI DELAWARE INC

AI summary

Optical subassembly grounding in an optoelectronic module. In one example embodiment, a conductive OSA grounding gasket assembly includes a top gasket and a bottom gasket. The top gasket includes a top shell surface and a top OSA surface. The top shell surface is configured to be in direct physical contact with a conductive top shell of an optoelectronic module. The top OSA surface is configured to make direct physical contact with a conductive housing of an OSA. The bottom gasket includes a bottom OSA surface and a bottom shell surface. The bottom OSA surface is configured to be in direct physical contact with the conductive housing of the OSA. The bottom shell surface is configured to make direct physical contact with a conductive bottom shell of the optoelectronic module.