Conductive Glue Capacitance Signature for IC Authentication
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Solution Overview
Problem
It is challenging to verify the authenticity of the assembly of an integrated circuit and a substrate in electronic devices, such as smart cards, as existing methods fail to reliably distinguish between authentic and counterfeit combinations, making them susceptible to tampering.
Innovation Solution
The use of conductive glue with a quasi-random distribution of conductive particles between the integrated circuit and the substrate creates a unique capacitance signature, which can be measured to authenticate the assembly, leveraging physical unclonable functions (PUFs) to ensure unique identification of each assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional assembly methods are used to attach integrated circuit to substrate, then manufacturing is simple and low cost, but authenticity verification is impossible
Solution Approach 1:
A layer of conductive glue is introduced as an intermediary material between the integrated circuit and substrate. This conductive glue contains conductive particles that create unique capacitance signatures, enabling authenticity verification without complicating the overall assembly process. The conductive glue serves as both an adhesive and a verification medium.
Solution Approach 2:
The invention utilizes changes in capacitance parameters caused by the random distribution of conductive particles in the conductive glue layer. By measuring the unique capacitance signature that emerges from this random distribution, the system can verify authenticity. The parameter change (capacitance variation) provides the verification capability without requiring complex structural modifications.
2Reliability
If unique identification of assembly is required, then security is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The conductive glue layer performs dual functions: it provides mechanical adhesion between the integrated circuit and substrate, and simultaneously generates unique capacitance signatures for authentication. This self-service approach means the same component (conductive glue) that is necessary for assembly also provides the security feature, eliminating the need for separate authentication mechanisms and keeping manufacturing simple.
Solution Approach 2:
The random distribution of conductive particles naturally creates unique capacitance parameters for each assembly. By measuring these capacitance values, the system obtains unique identification without requiring complex manufacturing processes. The parameter measurement is simple and can be integrated into existing manufacturing workflows.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the verification of the authenticity of the IC-substrate assembly with minimal resources and low costs, providing a secure and reliable method to prevent counterfeiting by utilizing the unique capacitance signature generated by the conductive glue's particle distribution.
Implementation Method 1
each pair of first electrodes and second electrodes is arranged to receive the voltage generator input, such that a capacitance develops between each pair, wherein at least a part of said capacitance develops through the layer of conductive glue
Data Source
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AI summary
According to a first aspect of the present disclosure, an electronic device is provided which comprises: a substrate; an integrated circuit; a layer of conductive glue between the substrate and the integrated circuit; at least one first electrode (400) connected to the conductive glue and at least one second electrode (402) connected to the conductive glue; wherein the first electrode and the second electrode are arranged to receive a voltage generator input, such that a capacitance develops between said first electrode and second electrode, wherein at least a part of said capacitance develops through the layer of conductive glue; and wherein the first electrode and the second electrode are arranged to output said capacitance. According to a second aspect of the present disclosure, a corresponding method of manufacturing an electronic device is conceived.