Conductive Grid Thickness Control for Display Panel Light Leakage
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Solution Overview
Problem
Existing manufacturing methods for electronic devices, particularly display panels, face challenges in achieving high display quality and yield rate due to issues with conductive layer thickness and uniformity.
Innovation Solution
A manufacturing method involving the formation of a conductive layer with a grid structure on a substrate, where the layer includes portions with different thicknesses achieved through patterning and electroplating steps, or alternatively, using inkjet printing to control the thickness of the conductive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a uniform conductive layer is used, then the manufacturing process is simple, but light leakage occurs and display quality deteriorates
Solution Approach 1:
The conductive layer is designed with different thicknesses in different regions: thicker in pixel electrode regions to prevent light leakage, and thinner in grid structure regions to reduce electrical resistance. This local variation in thickness resolves the contradiction by optimizing each region's properties for its specific function.
Solution Approach 2:
The invention transitions from a two-dimensional uniform conductive layer to a three-dimensional non-uniform thickness profile. By controlling thickness variation in the vertical dimension, the patent simultaneously achieves light leakage prevention in pixel regions and low resistance in grid regions.
2Reliability
If the conductive layer thickness is increased to prevent short circuits, then reliability improves, but manufacturing precision requirements increase
Solution Approach 1:
Different thickness specifications are applied to different regions: pixel electrodes use thicker layers (e.g., 50-200 nm) for reliable insulation, while grid structures use thinner layers (e.g., 10-50 nm) to maintain low resistance. This localized approach reduces overall manufacturing precision requirements compared to a uniform thick layer.
Solution Approach 2:
The patent applies thickness control selectively rather than uniformly. By using thicker material only where needed for short circuit prevention and thinner material where conductivity is prioritized, the manufacturing precision burden is distributed and reduced.
3Object-affected harmful factors
If electroplating is used to create non-uniform thickness, then display quality improves, but process complexity increases
Solution Approach 1:
A uniform conductive layer is deposited first as a base layer, then electroplating is applied selectively to specific regions requiring additional thickness. This preliminary uniform deposition simplifies the overall process by separating the base formation from the selective thickening steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances display quality by reducing light leakage and manufacturing errors, while also improving the yield rate by ensuring precise thickness control and reducing the risk of short circuits.
Implementation Method 1
performing an electroplating step to electroplate at least one of the first portion and the second portion, such that a thickness of the first portion is different from a thickness of the second portion after performing the electroplating step
Implementation Method 2
performing an inkjet printing step to form a conductive layer on the substrate. The conductive layer includes a grid structure having a plurality of grid units, the conductive layer includes a first portion and a second portion at least, and a thickness of the first portion is different from a thickness of the second portion
Data Source
AI summary
A manufacturing method of an electronic device includes: providing a substrate; disposing a conductive layer on the substrate; performing a patterning step to pattern the conductive layer, such that a grid structure having a plurality of grid units is formed in the conductive layer, and the conductive layer which is patterned includes a first portion and a second portion at least; and performing an electroplating step to electroplate at least one of the first portion and the second portion, such that a thickness of the first portion is different from a thickness of the second portion after performing the electroplating step.