Conductive Grid Verification for Blister Pack Compliance Tags

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Solution Overview

Problem

The manufacturing process for Med-ic™ electronic compliance monitor (ECM) tags, used in blister packaging for medical items, requires precise assembly and quality assurance to ensure accurate recording of pill dispensing times, but existing methods lack comprehensive verification of electrical components and grid integrity.

Innovation Solution

A method involving the preparation of electronic tags with microcontrollers, capacitors, oscillators, and diodes, followed by printing conductive traces on substrates, verifying resistance levels, and permanently connecting the tags to grids, ensuring alignment and integrity for accurate recording of rupture events.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If comprehensive verification steps are added to the manufacturing process, then reliability and manufacturing precision are improved, but device complexity and manufacturing time increase

Engineering Contradiction:
Improveintegrity verificationVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements preliminary verification actions during the manufacturing process itself. Resistance levels of conductive traces are verified immediately after printing, and grid integrity is checked before final assembly. This ensures defects are detected and corrected early, improving reliability without requiring complex post-manufacturing verification systems.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The manufacturing process incorporates feedback mechanisms where verification results are used to control subsequent steps. If resistance levels are out of specification, the process can halt or rework that specific grid. This feedback loop ensures high reliability while keeping the overall process manageable through automated decision-making.

Inventive Principle:
Principle #23Feedback

2Manufacturing precision

If multiple verification steps are implemented, then manufacturing precision is improved, but productivity decreases

Engineering Contradiction:
Improvealignment precisionVSAvoidmanufacturing speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

Alignment verification is performed preliminarily during the grid printing process rather than after assembly. The predetermined pattern of conductive traces is printed with built-in alignment features that can be verified immediately, ensuring precision before the time-consuming assembly steps occur.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent replaces manual alignment verification with automated resistance measurement systems. Electrical resistance measurements provide precise verification of trace connectivity and alignment without requiring complex mechanical inspection equipment or manual measurement, thereby maintaining high precision while improving productivity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If resistance verification is performed on all traces, then reliability is improved, but manufacturing time increases

Engineering Contradiction:
Improveelectrical integrityVSAvoidverification time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

Resistance verification is performed as a preliminary step immediately after trace printing and before assembly. This timing allows verification to be done when traces are most accessible and stable, reducing overall manufacturing time while ensuring electrical integrity is established early in the process.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The conductive traces themselves serve as the verification target without requiring additional test structures or complex measurement setups. By measuring the resistance of the traces directly as printed, the system uses the traces' own electrical properties for verification, simplifying the process and reducing time compared to using separate test structures.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS7937829B2Method for manufacturing a conductive grid for attachment to a blister package
Publication Date: 2011.05.10 INTELLIGENT DEVICES SEZC
  • US7937829B2 patent drawing
  • US7937829B2 patent drawing
  • US7937829B2 patent drawing

AI summary

The Med-ic™ Electronic Compliance Monitor (ECM) addresses the problem of patient non-compliance with prescribed medication. The Med-ic™ ECM provides precise information about the patient's use of blister-packaged medication in clinical research and general pharmacy settings. Using an on-board central processing unit (CPU), the Med-ic™ ECM records the time each tablet or capsule is expelled from the blister package, keeping a record for later analysis. At the time of refilling or follow-up visit, the information is downloaded to the research assistant's, physician's or pharmacist's computer where it can be displayed graphically. The data can be stored for later analysis. Production of a Med-ic™ ECM Tag involves numerous steps. These steps incorporate certain methods and technologies to accomplish their objective, the steps being detailed in the specification.