Conductive Heat Sink and Bracket for Shielding and Thermal Management
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Solution Overview
Problem
In electronic devices with high heat flux density and miniaturized components, conventional heat dissipation methods face challenges due to increased power consumption and integration levels, particularly in shielding cavities where direct contact between heat sinks and components is hindered by shielding cases, leading to inefficient heat dissipation and electromagnetic compatibility issues.
Innovation Solution
A shielding and heat dissipation device is designed with a conductive bracket on the PCB connected to a heat sink with a conductive surface, forming a complete shielding cavity and ensuring direct contact for effective heat dissipation, using elastic sheetmetals or conductive foams to secure the heat sink and reduce thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding case is used to enclose electronic components for electromagnetic shielding, then shielding effectiveness is improved, but direct contact between heat sinks and components is hindered, leading to inefficient heat dissipation
Solution Approach 1:
The shielding case is segmented into two parts: a shielding body for electromagnetic shielding and a separate heat sink for heat dissipation. The heat sink is positioned below the shielding case, allowing it to contact the component directly for effective heat dissipation while the shielding case provides electromagnetic protection. This segmentation resolves the contradiction by separating the shielding function from the heat dissipation function.
Solution Approach 2:
A conductive bracket serves as an intermediary element between the heat sink and the shielding case. The bracket is electrically connected to both the heat sink and the shielding case, forming a complete shielding cavity while enabling thermal conduction from the component to the heat sink. This intermediary resolves the contradiction by maintaining both shielding integrity and heat dissipation effectiveness.
2Volume of moving object
If integration level for parts is increased to achieve miniaturization, then device size is reduced, but heat flux density increases and heat dissipation becomes more difficult
Solution Approach 1:
The heat sink is designed to extend in the vertical dimension below the shielding case, creating a three-dimensional heat dissipation structure. This dimensional extension allows the heat sink to access thermal pathways that are not available in planar configurations, effectively managing high heat flux density in a miniaturized device.
Solution Approach 2:
The heat sink surface is treated with high-reflectivity coating to change the thermal radiation parameters, enhancing heat dissipation efficiency. This parameter change allows the heat sink to effectively manage high heat flux density by optimizing thermal radiation characteristics, resolving the contradiction between miniaturization and heat dissipation.
3Power
If power consumption is increased to achieve higher processing power, then device functionality is improved, but heat generated by components increases, forming a bottleneck in heat dissipation
Solution Approach 1:
The heat dissipation system is designed to operate continuously and efficiently, with the heat sink maintaining constant thermal contact with the component and the conductive bracket continuously conducting heat from the component through the bracket to the heat sink and shielding case. This continuous thermal management action resolves the contradiction by ensuring heat dissipation keeps pace with continuous power consumption.
Solution Approach 2:
The heat sink is constructed using composite materials with high thermal conductivity to efficiently conduct heat away from the component. The combination of materials is optimized to provide both thermal management performance and mechanical stability, resolving the contradiction between high power consumption and effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves improved heat dissipation and electromagnetic shielding without compromising electrical indices, reducing thermal resistance and enhancing the stability and efficiency of heat sink installation, while maintaining the integrity of the shielding cavity.
Implementation Method 1
a heat sink arranged above the heat-generating electronic component and provided with a conductive surface electrically connected to the conductive bracket
Implementation Method 2
the conductive surface of the heat sink, as a part of a shielding cavity, may form a complete shielding cavity with the conductive bracket and the conductive layer on the PCB
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
Discloses herein is a shielding and heat dissipation device comprising a conductive bracket (1) provided on a PCB around a shielded heat-generating electronic component, and electrically connected to a conductive layer of the PCB; a heat sink (2), which is arranged above the heat-generating electronic component (3) and is provided with a conductive surface electrically connected to the conductive bracket (1). With the conductive surface, which may be used to replace a top cover of a prior art shielding case, developed on the bottom or sidefaces of the heat sink, an effective shielding cavity is formed by conductively connecting the conductive surface of the heat sink to the other parts of the shielding case. That is to say, the conductive surface of the heat sink serves as a part of the shielding case, so that the heat sink may play a role in electromagnetic shielding as well as in dissipating heat sufficiently.