Thermally Conductive Hinge for Portable System Heat Dissipation
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Solution Overview
Problem
Portable information handling systems face challenges with thermal management due to limited space for active cooling, leading to excessive mechanical stress and reduced processing performance from thermal constraints, especially in low profile configurations where passive cooling is relied upon.
Innovation Solution
The integration of a thermal conduit that transfers heat between rotationally coupled housing portions, utilizing vapor chambers and graphite thermal spreaders to efficiently dissipate thermal energy across a greater surface area, managed by adjusting internal pressure and saturation points to maintain component temperatures within thresholds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If passive cooling is used in low profile information handling systems, then the system thickness is reduced, but thermal management capability deteriorates leading to excessive temperatures
Solution Approach 1:
The patent transfers thermal energy from the base housing portion to the lid housing portion, utilizing the lid's outer surface as an additional thermal dissipation dimension. This allows heat to be rejected from a different spatial location, effectively increasing the thermal management capability without increasing system thickness.
Solution Approach 2:
The hinge assembly serves as a thermal intermediary, containing thermal conduits that transfer thermal energy from the base housing portion to the lid housing portion. This mediator enables thermal dissipation across housing portions while maintaining the low profile configuration.
2Productivity
If processing power is increased, then productivity is improved, but thermal energy generation increases leading to thermal constraints
Solution Approach 1:
The patent extracts thermal energy from the base housing portion where processing components are located and transfers it to the lid housing portion. This separation of thermal generation and thermal rejection enables higher processing power by removing the thermal constraint from the processing area.
Solution Approach 2:
The lid housing portion serves multiple functions: it provides structural support, houses the display, and acts as a thermal dissipation structure. By utilizing the lid for thermal rejection, the system gains additional thermal management capability without adding dedicated cooling components.
3Device complexity
If thermal energy is concentrated in one housing portion, then the thermal path is simplified, but mechanical stress increases due to thermal expansion
Solution Approach 1:
The patent segments the thermal management function across two housing portions (base and lid), with thermal conduits in the hinge assembly creating separate thermal paths. This segmentation distributes thermal energy and reduces concentration in a single location, thereby reducing thermal expansion stress.
Solution Approach 2:
The hinge assembly provides rotational movement capability between the base and lid housing portions, allowing the structure to dynamically accommodate thermal expansion and contraction. This dynamic joint reduces mechanical stress by permitting controlled movement rather than rigid constraint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances passive thermal transfer and cooling efficiency, allowing for increased processing power while maintaining system temperatures within safe limits, even in low profile designs, by effectively distributing thermal energy across a larger surface area and dynamically controlling thermal dissipation.
Implementation Method 1
a thermal conduit that transfers thermal energy from a first housing portion to a second housing portion
Implementation Method 2
utilizing vapor chambers and graphite thermal spreaders to efficiently dissipate thermal energy across a greater surface area
Implementation Method 3
utilizing vapor chambers and graphite thermal spreaders to efficiently dissipate thermal energy across a greater surface area
Data Source
AI summary
A portable information handling system transfers thermal energy associated with operation of a CPU from a main housing portion to a lid housing portion with thermal conduction through a hinge assembly that rotationally couples the main and lid housing portions to each other. For example, thermal conduits insert into a hinge body and transfer thermal energy across the hinge body through a thermally conductive interface, such as the hinge body itself, thermal grease disposed in the hinge body, a liquid that fills a cavity of the hinge body shared by the thermal conduits, and a vapor chamber integrated in the hinge body.