Conductive Ink Composition for Additive Circuit Fabrication
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Solution Overview
Problem
The existing semiconductor circuit board manufacturing processes, particularly those using the subtractive method, are time-consuming and costly, with high energy requirements for sintering, and generate environmental hazards due to the use of etching and high-energy sintering methods.
Innovation Solution
A conductive ink composition comprising composite metal nanoparticles and a polymer matrix, suitable for additive methods like inkjet printing, which includes copper and silver nanoparticles, and a method for manufacturing this ink using specific solvents and ultrasonication, followed by light sintering with pulsed light to form conductive thin films efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the subtractive method (etching) is used to manufacture circuit boards, then the circuit pattern can be formed on the substrate, but the manufacturing process becomes complicated and time-consuming with increased production cost
Solution Approach 1:
The patent inverts the conventional subtractive approach by using an additive method: instead of forming a complete conductive layer and then removing unwanted portions through etching, the invention directly forms the circuit pattern by printing conductive ink only where needed. This reverses the manufacturing logic from subtraction to addition, simplifying the process while maintaining pattern precision
Solution Approach 2:
The patent extracts and eliminates unnecessary manufacturing steps from the conventional process. By using direct printing of conductive ink, it removes the need for laminate formation, resist coating, etching, and washing steps that are inherent in the subtractive method, thereby simplifying the overall manufacturing process
2Manufacturing precision
If the subtractive method (etching) is used to manufacture circuit boards, then the circuit pattern can be formed on the substrate, but production cost increases due to complicated processes and environmental treatment requirements
Solution Approach 1:
The patent extracts and eliminates the need for environmental treatment processes by replacing the etching method with direct printing. Since no acid etching is involved, there are no harmful discharged solutions requiring neutralization and treatment, thereby reducing production costs associated with environmental compliance
Solution Approach 2:
The patent uses a simple, inexpensive conductive ink composition that can be directly printed and sintered without requiring expensive equipment or complex process steps. The ink formulation using metal nanoparticles and polymer binder provides a cost-effective alternative to traditional etching materials and processes
3Reliability
If high energy sintering methods are used to process the conductive ink, then the conductive pattern can be formed, but the sintering time increases and cost increases
Solution Approach 1:
The patent changes the physical and chemical parameters of the conductive ink composition to enable low-energy sintering. By using metal nanoparticles (0.1-10 μm) with high surface area to volume ratio and a polymer binder with appropriate glass transition temperature, the ink can be sintered at lower temperatures and shorter times while maintaining reliable conductive pattern formation
Solution Approach 2:
The patent uses a composite material system consisting of metal nanoparticles dispersed in a polymer binder matrix. This composite structure allows the conductive ink to achieve both good adhesion to the substrate and effective conductivity after sintering, while enabling lower energy input compared to using pure metal powders or traditional conductive pastes
4Reliability
If high energy sintering methods are used to process the conductive ink, then the conductive pattern can be formed, but the sintering time increases
Solution Approach 1:
The patent optimizes the particle size parameters of the metal nanoparticles to be in the range of 0.1-10 μm, which provides sufficient surface area for rapid sintering while maintaining good flow and printing characteristics. This parameter optimization enables the sintering process to complete quickly at lower temperatures, reducing sintering time while ensuring reliable conductive pattern formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the rapid, low-cost production of conductive thin films with improved electrical conductivity and reduced environmental impact by using a low-energy, additive method that simplifies the manufacturing process and minimizes substrate damage.
Implementation Method 1
light sintering with pulsed light to form conductive thin films efficiently
Implementation Method 2
a method for manufacturing this ink using specific solvents and ultrasonication
Data Source
AI summary
Disclosed is a conductive ink composition, a manufacturing method thereof, and a manufacturing method of a conductive thin film using the same, and more specifically, a conductive ink composition is provided that includes composite metal nanoparticles including first metal nanoparticles and second metal nanoparticles, and a polymer matrix. The polymer matrix is a composition including a polymer and a solvent, the first metal nanoparticles and the second metal nanoparticles are different metals, and the content of the composite metal nanoparticles is about 20 to about 25 wt %, the content of the polymer is about 5 to about 10 wt %, and the content of the solvent is about 65 to about 75 wt %, based on the total weight of the composition.