Conductive Ink Anti-Cracking Agent for Wiring Substrates
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Solution Overview
Problem
Conductive patterns formed using conventional conductive pattern formation inks often suffer from cracking issues during solvent evaporation, leading to increased specific resistance and reduced high-frequency characteristics, especially as the patterns grow thicker.
Innovation Solution
A conductive pattern formation ink comprising a dispersion solution with metal particles and an anti-cracking agent, such as polyglycerin, is used to prevent cracking by stabilizing the metal particles and maintaining their close bonding, thereby reducing specific resistance and enhancing high-frequency characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a thick conductive pattern is formed by overlappingly applying conductive pattern formation ink, then the conductive pattern thickness is increased, but cracks are more likely to generate during solvent evaporation
Solution Approach 1:
The patent applies a preliminary drying step between overlapping ink applications to partially evaporate solvent before applying the next layer. This controlled intermediate drying prevents excessive solvent accumulation that would cause cracking in thick patterns, while still achieving the desired thickness through multiple layers.
Solution Approach 2:
The patent modifies the drying conditions by controlling temperature and time parameters during the preliminary drying step. By adjusting these parameters, the solvent evaporation rate is optimized to prevent crack formation while maintaining pattern integrity during thick conductive pattern formation.
2Reliability
If the conductive pattern is made thicker to reduce specific resistance, then the conductivity is improved, but the pattern becomes more prone to cracking and disconnection
Solution Approach 1:
The preliminary drying step creates a partially dried intermediate state that maintains pattern flexibility and adhesion. This prevents the brittle structure that would form with complete drying before subsequent layer application, thereby maintaining pattern integrity in thicker conductive patterns.
Solution Approach 2:
The patent creates a composite structure through multiple overlapping layers of conductive ink. Each layer is applied to a partially dried previous layer, creating a laminated composite structure that combines the conductivity benefits of multiple layers with the mechanical strength provided by the controlled drying process.
3Volume of moving object
If overlapping application is used to form thick conductive patterns, then the pattern thickness is increased, but interlayer specific resistance increases leading to higher overall resistance
Solution Approach 1:
The preliminary drying step optimizes the surface state of the previous layer to enhance adhesion and electrical contact with the next layer. This controlled intermediate drying creates optimal conditions for interlayer bonding, reducing interlayer specific resistance while maintaining the benefits of multiple layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ink effectively reduces the likelihood of crack formation, achieves low specific resistance, and maintains high-frequency performance even in thicker conductive patterns, improving the overall quality of the conductive patterns and wiring substrates.
Implementation Method 1
an anti-cracking agent, such as polyglycerin, is used to prevent cracking by stabilizing the metal particles and maintaining their close bonding
Implementation Method 2
the ink thus applied is transformed into a conductive pattern by subsequently evaporating a solvent through a heat treatment or laser irradiation
Implementation Method 3
maintaining their close bonding, thereby reducing specific resistance
Data Source
AI summary
A conductive pattern formation ink capable of producing a conductive pattern with reduced likelihood of generation of cracks, a conductive pattern which is small in the number of cracks generated, low in specific resistance and superior in high-frequency characteristics, and a wiring substrate provided with the conductive pattern which is small in the number of cracks generated, low in specific resistance and superior in high-frequency characteristics are provided. The conductive pattern formation ink is used for forming a conductive pattern on a base member by patterning and comprised of a dispersion solution. The dispersion solution includes a solvent, metal particles dispersed in the solvent, and an anti-cracking agent contained in the solvent, wherein the anti-cracking agent is contained for preventing generation of cracks in the conductive pattern during desolvation of the solvent.