Printed Wiring Harness Structure for PCB-Free Electrical Routing
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Solution Overview
Problem
The existing wiring harness production methods are complex, costly, and have low automation, making them inefficient for large-scale electrical connections, and the conventional Printed Circuit Boards (PCBs) are not suitable for large-scale devices due to high production costs and environmental pollution.
Innovation Solution
A method involving the preparation of a printing plate and substrate, followed by printing conductive ink to form conductive loops, which are then insulated with a protective layer, allowing for rapid and automated production of wiring harnesses with high efficiency and flexibility, including multi-layer designs and complex electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If conventional wiring harness production methods are used, then the wiring harness can be produced, but the production process is complex and the automation degree is low
Solution Approach 1:
The patent replaces traditional mechanical wiring harness assembly processes with a printing-based system. Conductive ink is printed directly onto the substrate to form conductive loops, eliminating the need for mechanical assembly of wires, terminals, and connectors. This substitution dramatically increases automation while simplifying the production process.
Solution Approach 2:
The patent changes the physical state and form of conductive materials from traditional wire-based mechanical components to ink-based printable material. By transforming conductive ink from a liquid state during printing to a solid conductive loop after drying, the process achieves high automation and simplifies production while maintaining electrical functionality.
2Productivity
If PCB production method is used, then dense electrical loop can be formed rapidly, but the production cost is high and the production process is complex
Solution Approach 1:
The patent uses inexpensive conductive ink and simple substrates instead of costly PCB materials and equipment. The printed conductive loops achieve the necessary electrical connection function without requiring the complex, expensive PCB manufacturing infrastructure, thereby reducing production costs while maintaining rapid production capability.
Solution Approach 2:
The patent extracts only the essential function of electrical connection from the complex PCB system. By using simple substrates with printed conductive loops, it eliminates unnecessary PCB components and processes while retaining the core functionality of forming dense electrical loops rapidly.
3Productivity
If PCB production method is used, then dense electrical loop can be formed rapidly, but great pollution to the environment is caused
Solution Approach 1:
The patent eliminates the harmful etching process of PCB production by using a printing-based approach. Conductive ink is deposited only where needed through printing, avoiding the chemical etching that causes environmental pollution, while still achieving rapid formation of dense electrical loops.
Solution Approach 2:
The patent replaces the chemical etching process with a printing-based deposition method. Instead of using corrosive chemicals to remove material and create conductive paths, the system prints conductive ink directly onto the substrate, eliminating environmental pollution while maintaining high productivity.
4Ease of operation
If traditional wiring harness components are used, then electrical connection can be realized, but mounting and assembly is time-consuming
Solution Approach 1:
The patent merges multiple separate components (wires, terminals, connectors, insulation) into a single integrated structure. The conductive ink printed on the substrate forms complete electrical connections in one step, eliminating the need for separate mounting and assembly operations, thereby reducing assembly time while improving ease of operation.
Solution Approach 2:
The patent performs preliminary action by pre-forming the complete wiring harness structure through printing before deployment. The conductive loops are created in advance on the substrate, eliminating the need for time-consuming on-site assembly and mounting operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables rapid, automated, and cost-effective production of wiring harnesses with high efficiency, ease of assembly and disassembly, and adaptability to complex environments, reducing maintenance costs and electromagnetic interference, while minimizing environmental impact.
Implementation Method 1
coagulating the conductive ink to form a conductive loop
Implementation Method 2
forming an insulating protective layer around the conductive loop and on a surface thereof
Data Source
AI summary
The present disclosure provides a wiring harness production method and a wiring harness. The wiring harness production method includes: Step S10: preparing a printing plate; Step S20: preparing a substrate; Step S30: printing conductive ink onto the substrate by means of the printing plate; Step S40: coagulating the conductive ink to form a conductive loop; and Step S50: forming an insulating protective layer around the conductive loop and on a surface thereof. The present disclosure solves the technical problems of complex production process and high processing cost of a wiring harness for electrically connecting electrical components.