Conductive Ink Composition Using Metal Complexes for Low-Temperature Film Formation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conductive ink compositions derived from silver compounds lack stability and solubility, requiring high decomposition temperatures and complex processes, making them unsuitable for various substrates and applications.
Innovation Solution
A conductive ink composition is developed using a metal complex compound formed by reacting metals or metal compounds with ammonium carbamate- or ammonium carbonate-based compounds, enabling superior stability, solubility, and low-temperature calcination for uniform and precise film or pattern formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional metal compounds (silver nitrate, hydrogen tetrachloroaurate, copper sulfate) are used to form conductive inks, then conductivity can be achieved, but the decomposition temperature becomes too high and the process becomes complicated
Solution Approach 1:
The patent changes the chemical parameters by using metal carboxylate complexes instead of conventional metal compounds. These complexes have different thermal decomposition characteristics, allowing decomposition at lower temperatures (200-400°C) while maintaining good conductivity, thus resolving the contradiction between achieving conductivity and avoiding high decomposition temperatures
Solution Approach 2:
The patent employs composite material structures by forming metal complexes with organic carboxylate ligands. These composite complexes combine the conductive properties of metals with the stability and solubility of organic compounds, enabling low-temperature decomposition while maintaining reliability and conductivity
2Ease of manufacture
If metal carboxylate complexes are used, then preparation becomes easier, but solubility in organic solvents decreases and decomposition occurs at high temperature
Solution Approach 1:
The patent modifies the molecular parameters of the carboxylate ligands by introducing long alkyl chains (such as 2-ethylhexanoate). This structural modification increases solubility in organic solvents while maintaining the ease of preparation and low decomposition temperature characteristics of metal carboxylate complexes
3Manufacturing precision
If conventional conductive inks are used, then metal film formation is possible, but the process requires high baking temperature making it unsuitable for various substrates
Solution Approach 1:
The patent changes the thermal decomposition parameters of the metal precursors by using carboxylate complexes with long alkyl chains. This enables the metal film formation process to occur at lower baking temperatures (200-400°C), expanding substrate compatibility while maintaining manufacturing precision and film quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ink composition achieves stable and soluble conductive films or patterns on diverse substrates at low temperatures, ensuring good conductivity and adhesivity, suitable for applications like EMI shielding, PCBs, RFID tags, and flexible displays.
Implementation Method 1
the high baking temperature makes them inappropriate to be applied for a variety of substrates
Data Source
AI summary
The present invention relates to a variety of conductive ink compositions comprising a metal complex compound having a special structure and an additive and a method for preparing the same, more particularly to conductive ink compositions comprising a metal complex compound obtained by reacting a metal or metal compound with an ammonium carbamate- or ammonium carbonate-based compound and an additive and a method for preparing the same.