Conductive Ink PCB Plating Layers Solder Melting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conductive ink/paste-based PCBs face issues with low melting points, leading to circuit pattern melting during soldering, and conventional conductive adhesives have lower productivity and poor storage properties compared to soldering methods.
Innovation Solution
A PCB manufacturing method involving printing conductive ink/paste on a substrate, followed by electroless or electrolytic plating of high-melting point metals to form primary and secondary plating layers, which improves wetting with solder and enhances adherence of parts using solder at high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conductive ink/paste is used to form circuit patterns on substrate, then manufacturing cost is reduced and productivity is improved, but the circuit pattern melts down during soldering due to low melting point
Solution Approach 1:
The patent applies composite materials by combining conductive ink/paste with a protective coating layer that has high melting point properties. This composite structure allows the circuit pattern to maintain its low-cost, high-productivity advantages while the protective layer prevents melting during soldering processes, thus resolving the contradiction between productivity and reliability.
2Reliability
If conductive adhesive is used to adhere parts to circuit pattern, then circuit pattern melting is prevented, but productivity significantly decreases and material cost increases
Solution Approach 1:
The patent uses a disposable protective coating layer that can be applied cheaply and removed after serving its purpose of preventing circuit pattern melting. This approach is more economical and productive than using expensive conductive adhesives, as the coating can be applied through efficient processes like spray coating or dip coating, and then removed without affecting the underlying circuit pattern.
3Reliability
If conductive adhesive is used to adhere parts to circuit pattern, then circuit pattern melting is prevented, but storage property of material deteriorates and material cost increases
Solution Approach 1:
The protective coating layer is designed as a disposable material with excellent storage properties. It can be stored under normal conditions without degradation, unlike conductive adhesives that require special storage conditions. The coating maintains its protective function until applied, at which point it serves its purpose and is removed, eliminating long-term storage concerns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces electric resistance, improves coherence between the substrate and circuit pattern, and increases productivity while maintaining better storage properties and cost-effectiveness compared to traditional methods.
Implementation Method 1
a primary plating layer formed through electroless plating or electrolytic plating of a high-melting point metal on the circuit pattern
Implementation Method 2
a primary plating layer formed through electroless plating or electrolytic plating of a high-melting point metal on the circuit pattern
Implementation Method 3
When the conductive ink is printed on a substrate and heat is applied thereto at a specific temperature, organic additives such as dispersing agents are volatilized and gaps between the metal particles are contracted and sintered, forming conductors which are electromechanically connected to each other
Data Source
AI summary
A Printed Circuit Board (PCB) and a method for manufacturing the same are provided. A circuit pattern is formed by printing conductive ink/paste on a substrate, and sintering a layer of the conductive ink or curing a layer of the conductive paste by applying heat. A primary plating layer is formed through electroless plating or electrolytic plating of a high-melting point metal on the circuit pattern. A secondary plating layer is formed through electroless plating or electrolytic plating of a precious metal on the primary plating layer to improve wetting with solder.