Conductive Ink Deposition on Porous Substrates Without Heat Sintering
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Solution Overview
Problem
Existing methods for producing electrically conductive members using metal fine particles require high-temperature sintering, which limits their application to low-heat resistant substrates and flexible substrates, and results in insufficient bending resistance and electrical conductivity.
Innovation Solution
A method involving the application of an electrically conductive ink containing a metal fine particle dispersion to a substrate with a porous surface, where the metal fine particles are dispersed with a polymer having a glass transition temperature not higher than the formation temperature of the electrically conductive images, allowing necking between the metal fine particles to occur at ordinary temperatures and enhancing bending resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature sintering is used to form electrically conductive images with metal fine particles, then electrical conductivity is improved, but the method cannot be applied to low-heat resistant substrates and flexible substrates
Solution Approach 1:
The patent changes the temperature parameter from high-temperature sintering to ordinary-temperature processing by using a polymer dispersant with low glass transition temperature. This allows metal fine particles to be dispersed and bonded on heat-sensitive substrates without requiring high-temperature treatment, thereby expanding substrate compatibility while maintaining electrical conductivity.
Solution Approach 2:
The patent introduces a polymer dispersant as an intermediary substance between metal fine particles and the substrate. This polymer acts as a bonding agent that enables particle adhesion and electrical connection at ordinary temperatures, replacing the need for high-temperature sintering and enabling application on flexible and heat-sensitive substrates.
2Reliability
If conventional high-temperature sintering is applied, then electrical conductivity is achieved, but bending resistance is insufficient
Solution Approach 1:
The polymer dispersant serves as a flexible intermediary that bonds metal fine particles together and to the substrate. This polymer matrix provides mechanical flexibility and bending resistance while maintaining electrical conductivity through the metal particle network, solving both conductivity and durability requirements.
Solution Approach 2:
The patent creates a composite structure consisting of metal fine particles embedded in a polymer dispersant matrix. This composite material combines the electrical conductivity of metal particles with the mechanical flexibility and bending resistance of the polymer, achieving both electrical and mechanical performance requirements.
3Ease of manufacture
If metal fine particles are used without proper dispersion, then application is simple, but electrical conductivity and bending resistance are insufficient
Solution Approach 1:
The polymer dispersant acts as a mediator that simultaneously provides dispersion stability, adhesion, and electrical connectivity. By incorporating this intermediary substance, the patent maintains simple application processes while achieving reliable electrical conductivity and mechanical durability through the polymer-facilitated particle network.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the formation of electrically conductive images with ordinary-temperature sintering properties, excellent electrical conductivity, and improved bending resistance, suitable for various applications including flexible substrates.
Implementation Method 1
metal fine particles (a) dispersed with a polymer B
Implementation Method 2
the substrate has a porous surface
Data Source
AI summary
The present invention relates to a method for producing an electrically conductive member which includes the step of applying an electrically conductive ink containing a metal fine particle dispersion to a substrate to form electrically conductive images on the substrate under ordinary-temperature environments, thereby obtaining the electrically conductive member, in which the metal fine particle dispersion contains metal fine particles (a) dispersed therein with a polymer B; a glass transition temperature of the polymer B is not higher than a temperature at which the electrically conductive images are formed on the substrate; and the substrate has a porous surface.