Viscosity-Controllable Conductive Ink for Metal Patterns
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Solution Overview
Problem
Current methods for forming metal conductive patterns in semiconductor manufacturing, such as photolithography and ink jet printing, face high costs, environmental concerns, and inefficiencies due to complex processes, high temperature requirements, and issues with adhesion and conductivity.
Innovation Solution
A viscosity controllable highly conductive ink composition comprising nanoscale metal particles or metallo-organic decomposition compounds and a thermally decomposable organic polymer, which can be adjusted for desired viscosity and thickness through thermal treatment, allowing for simpler and more efficient formation of metal conductive layers using screen printing, spin coating, or ink jet printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography process is used to form metal conductive patterns, then manufacturing precision and adhesion are improved, but device complexity and manufacturing cost increase due to multiple complicated steps requiring high temperature and high pressure
Solution Approach 1:
The patent extracts and removes the photoresist layer and etching steps from the traditional photolithography process. By using a metal-containing ink composition that can be directly deposited and cured, the complex multi-step photolithography process is simplified into a single-step printing and curing process, eliminating the need for photoresist coating, exposure, development, and etching steps.
Solution Approach 2:
The patent replaces the mechanical and chemical etching process with a thermal curing process. Instead of using etching agents and complex photoresist systems, the metal-containing ink is directly deposited and then cured through UV irradiation or heat treatment, substituting the mechanical/chemical removal process with a thermal/photonic curing process that directly forms the conductive pattern.
2Ease of manufacture
If screen printing is used to form metal conductive patterns, then ease of manufacture is improved with simpler procedure and lower temperature, but adhesion deteriorates causing peeling and reduced yield
Solution Approach 1:
The patent uses a composite ink composition containing metal particles or metallo-organic decomposition compounds combined with organic solvents and binders. This composite formulation allows the ink to be printed using simple screen printing while the metal components provide strong adhesion to the substrate, preventing peeling and improving yield.
Solution Approach 2:
The patent changes the chemical composition parameters of the ink to achieve both ease of printing and strong adhesion. By selecting specific metal particles, solvents, and binders with appropriate properties, the ink maintains printability through screen printing while the metal components form strong bonds with the substrate, resolving the adhesion problem.
3Extent of automation
If ink jet printing with MOD inks is used to form metal conductive patterns, then ease of manufacture and automation are improved, but viscosity is too low causing poor printability and requiring additional processing
Solution Approach 1:
The patent adjusts the viscosity parameter of the ink composition by selecting appropriate organic solvents and binders with suitable molecular weights and viscosities. The modified ink maintains the low-temperature processing advantage of MOD inks while achieving optimal viscosity for ink jet printing, eliminating the need for additional viscosity adjustment steps.
Solution Approach 2:
The patent introduces organic binders as intermediaries between the metal particles and the substrate. These binders provide the necessary viscosity and flow characteristics for ink jet printing while also facilitating proper adhesion and distribution of the metal components, enabling direct printing without additional processing.
4Manufacturing precision
If high temperature environment is used for metal layer deposition, then manufacturing precision is improved, but harmful factors increase due to metal vapor diffusion degrading equipment efficiency and causing damage
Solution Approach 1:
The patent replaces the high-temperature physical vapor deposition process with a low-temperature ink printing and curing process. By using liquid or paste ink formulations that can be directly deposited and then cured through UV irradiation or moderate heat treatment, the process eliminates metal vapor diffusion and its associated harmful effects on equipment while maintaining deposition quality.
Solution Approach 2:
The patent changes the temperature parameter from high temperature deposition to low-temperature curing. The ink formulation is designed to remain stable at room temperature or slightly elevated temperatures during printing, then undergoes curing at moderate temperatures (or via UV irradiation at room temperature), completely avoiding the high-temperature vapor phase that causes metal diffusion and equipment damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the formation of thick, conductive metal layers with improved adhesion and reduced sheet resistance, reducing manufacturing costs and time while maintaining high conductivity, thus enhancing the performance of integrated circuits and liquid crystal displays.
Implementation Method 1
a thermally decomposable organic polymer... can be removed by subsequent thermal treatment, so as to decrease the impact on conductivity by organic polymer
Implementation Method 2
utilizes a ink composition containing a metallo-organic decomposition compounds, MOD, decomposable at a low temperature followed by transferring to metal or metal oxide
Implementation Method 3
the volatile organic molecules are removed to form a metal conductive layer
Data Source
AI summary
A viscosity controllable highly conductive ink composition. The highly conductive ink composition comprises an organic solvent, nanoscale metal particles or metallo-organic decomposition compounds, and a thermally decomposable organic polymer. Specifically, since the thermally decomposable polymer can increase the viscosity of the highly conductive ink composition and be removed by subsequent thermal treatment, so as to decrease the impact on conductivity by organic polymer. Therefore, a viscosity-controllable conductive ink composition is obtained.