Conductive Insertion Substrate for Semiconductor Package Grounding
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Solution Overview
Problem
Conventional semiconductor packages face high manufacturing costs and reliability issues due to the need for multilayer flexible substrates to enhance ground and power supply lines for high-speed electronic devices, which increases noise and heat generation.
Innovation Solution
Incorporating a conductive insertion substrate that serves as part of the ground or power supply line, reducing the need for additional wiring layers in the flexible substrate, and forming bent parts in polygonal or circular shapes to enhance mechanical reliability and signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multilayer flexible substrate is used to enhance ground and power supply lines, then electric operation reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines the ground/power supply line function with the insertion substrate structure itself, rather than requiring separate dedicated wiring layers. The insertion substrate is configured to serve dual purposes: mechanical support and electrical grounding/power supply, thereby eliminating the need for additional multilayer wiring structures while maintaining reliability
Solution Approach 2:
The insertion substrate is designed to perform multiple functions simultaneously: it provides mechanical support for the electronic device, serves as a ground/power supply line, and enables signal transmission. This multi-functionality eliminates the need for separate dedicated ground/power layers, reducing manufacturing complexity and cost while maintaining electrical reliability
2Object-affected harmful factors
If the area of ground line or power supply line is increased, then noise and heat generation are reduced, but device complexity increases
Solution Approach 1:
The patent merges the structural support function with the electrical function by making the insertion substrate itself conductive and serving as the ground/power supply line. This eliminates the need for separate extensive wiring patterns while providing sufficient ground/power area to reduce noise and heat
Solution Approach 2:
The insertion substrate is strategically positioned and configured to provide localized enhanced grounding and power supply exactly where needed around the electronic device, rather than requiring uniform extensive wiring throughout the entire substrate area
3Reliability
If bent parts are formed in polygonal or circular shapes, then mechanical reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs circular or polygonal bent shapes in the flexible substrate and insertion substrate, which distribute stress more evenly compared to sharp angular bends. This curvature approach improves mechanical reliability by reducing stress concentration points, while the standardized geometric forms facilitate consistent manufacturing
Data Source
AI summary
The present invention is directed to provide a semiconductor package and the like realizing reduced manufacturing cost and improved reliability by enhancing a ground line and/or a power supply line. A semiconductor package 50 includes: a semiconductor device 1 including a circuit face on which an external electrode is formed; an insertion substrate 2 forming a housing part in which the semiconductor device 1 is disposed; and an interposer substrate 5 including a wiring pattern 7 and whose both ends are bent along the insertion substrate 2. The insertion substrate 2 is made of a conductive material and is electrically connected to a ground line or a power supply line in the wiring pattern 7 in the interposer substrate 5.