Electronic I/O Board Heat Dissipation Through Conductive Insulation
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Solution Overview
Problem
Traditional electronic input/output devices for pumps and pumping systems face limitations due to size and positioning constraints, poor heat dissipation, complex assembly, and increased dimensions, which hinder efficient operation and automation.
Innovation Solution
An electronic input/output apparatus with a thermally conductive insulating element and vias that facilitate heat transfer from the electronic control board to the dissipator, allowing components to be arranged opposite the dissipator, reducing thermal resistance and electromagnetic emissions, and enabling easier assembly and disassembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the dissipator is placed close to the components of the electronic control board, then heat dissipation effectiveness is improved, but the flatness of the board surface deteriorates making it difficult to position insulating thermal conductors
Solution Approach 1:
The patent introduces a thermally conductive insulating element as an intermediary component between the electronic control board and the dissipator. This mediator element compensates for the poor flatness of the board surface while maintaining effective thermal contact, thus resolving the contradiction between heat dissipation effectiveness and manufacturing precision.
2Ease of manufacture
If the electronic board and dissipator are fixed by manually positioned fastening elements, then assembly is achievable, but manufacturing complexity and cost increase while automation becomes impossible
Solution Approach 1:
The dissipator is designed with self-aligning features that allow it to automatically position itself relative to the electronic board during assembly. This self-service mechanism eliminates the need for manually positioned fastening elements, enabling automated assembly while reducing manufacturing complexity.
3Productivity
If components are arranged on the electronic control board, then electromagnetic emissions occur, but device dimensions increase
Solution Approach 1:
The patent extracts the heat-generating and electromagnetic-emitting components from the main electronic control board and relocates them to a separate dissipator unit. This separation reduces electromagnetic emissions from the control board while maintaining component integration, thus resolving the contradiction between productivity and harmful emissions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation, reduces device dimensions, simplifies assembly, and improves efficiency and compactness, facilitating automation and EMC certification.
Implementation Method 1
a thermally conductive insulating element interposed between said electronic control board and said dissipator to increase the transmission of the heat outgoing from said vias in the direction of said dissipator
Implementation Method 2
a dissipator configured to dissipate the heat produced by said electronic control board
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
The invention relates to an input/output electronic apparatus (100) with improved dissipation for pumps and/or pumping systems comprising an electronic control board (2) having a plurality of components (21) and one or more vias (23), a dissipator (3) configured to dissipate the heat produced by the electronic control board (2), a thermally conductive insulating element (6) interposed between the electronic control board (2) and the dissipator (3), so as to increase the transmission of the heat outgoing from the vias (23) in the direction of the dissipator (3), wherein the components (21) are arranged on the surface of the electronic control board (2) opposite the surface facing the dissipator (3).