Conductive Interconnect Structure for Dense Substrate-Interposer Routing
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Solution Overview
Problem
The increasing complexity of integrated circuits and the need for a small form factor in mobile devices leads to a significant number of interconnects, which occupy substantial space and complicate semiconductor package design, reducing available area and increasing complexity.
Innovation Solution
A conductive structure with defined openings and electrically isolated interconnects is used to connect substrates and interposers, providing common voltage interconnections and reducing the need for additional interconnects, thereby optimizing space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of interconnects is increased to support more devices and complex integrated circuits, then electrical performance and device interconnection capability are improved, but the space occupied by interconnects increases and device complexity increases
Solution Approach 1:
The conductive structure merges multiple interconnect functions into a single integrated component. The walls of the conductive structure simultaneously provide mechanical support, electrical isolation, and conductive pathways, eliminating the need for separate supporting structures and reducing the overall space required for interconnections.
Solution Approach 2:
The conductive structure transitions from planar interconnects to a three-dimensional configuration with vertical walls and stacked terminals. This vertical stacking allows multiple interconnect functions to be achieved within a smaller footprint by utilizing the third dimension (height) rather than expanding horizontally.
2Reliability
If the number of interconnects is increased to provide more signal paths and common source signals, then electrical performance is improved, but the difficulty and complexity of semiconductor package design increases
Solution Approach 1:
The conductive structure serves multiple functions simultaneously: it provides common source signals (power/ground), signal paths, electrical isolation between different interconnects, and mechanical support. This multi-functionality reduces the number of separate components needed and simplifies the overall package design while maintaining high electrical performance.
Solution Approach 2:
The conductive structure acts as an intermediary component between the substrate and the interposer, consolidating multiple interconnect functions into a single mediator structure. This simplifies the interface between substrate and interposer while providing the necessary electrical connections and isolation.
3Reliability
If common ground interconnects are increased to provide adequate grounding for multiple devices, then electrical performance and signal integrity are improved, but the space available for other components and signal paths is reduced
Solution Approach 1:
The conductive structure provides common ground and power pathways in the vertical dimension through its walls and stacked terminals, rather than requiring extensive horizontal space. This allows adequate grounding for multiple devices while preserving horizontal space for other components and signal paths.
Solution Approach 2:
The conductive structure merges common ground, common power, and signal path functions into a single integrated structure. The walls provide common grounding while the openings and terminals provide signal paths, eliminating the need for separate dedicated ground interconnects and freeing up space.
Data Source
AI summary
A device includes a substrate, an interposer, a die disposed between the substrate and the interposer, and a conductive structure disposed between the substrate and the interposer. The conductive structure includes one or more walls defining one or more openings. The one or more walls are electrically connected to the substrate via a first plurality of terminals and to the interposer via a second plurality of terminals. The device further includes a plurality of interconnects disposed within the one or more openings and electrically isolated from the conductive structure. The plurality of interconnects electrically connect the substrate and the interposer.