Conductive Jumper Traces via Direct Deposition
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Solution Overview
Problem
The existing methods for forming conductive jumper traces in semiconductor devices are inefficient, particularly when long bond wires are required, leading to increased costs and reliability issues due to the complexity and length of the wiring process.
Innovation Solution
A method involving the formation of conductive jumper traces by depositing a conductive layer between trace lines on a substrate, where the conductive layer is initially in a liquid or paste state and then heated to conform to a covering layer, providing electrical connection without the need for lengthy bond wires, using materials like silver, platinum, gold, copper, carbon nanotubes, graphene, or organic metals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If long bond wires are used to form conductive jumper traces, then electrical connection between trace lines is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent replaces the mechanical bonding process (wire bonding) with a direct deposition process. Instead of mechanically attaching long bond wires to connect trace lines, the invention directly forms conductive material between the trace lines through deposition, eliminating the mechanical wire bonding step and reducing manufacturing complexity while maintaining electrical connection reliability
Solution Approach 2:
The invention extracts and eliminates the intermediate bond wire element from the electrical connection process. By directly depositing conductive material between trace lines, the patent removes the bond wire component entirely, simplifying the wiring structure and reducing manufacturing steps while achieving the same electrical connection function
2Reliability
If long bond wires are used for electrical connection, then conductivity is achieved, but manufacturing cost increases
Solution Approach 1:
The patent replaces the costly mechanical wire bonding process with a more economical direct deposition process. By eliminating the need for bond wires and their associated handling, alignment, and bonding equipment, the invention reduces manufacturing costs while maintaining electrical conductivity through direct material deposition between trace lines
Solution Approach 2:
The invention uses a disposable depositable conductive material layer instead of expensive, reusable bond wires. The deposited conductive material serves its purpose of establishing electrical connection and can be integrated into the manufacturing process more cost-effectively, eliminating the need for expensive wire bonding materials and processes
3Reliability
If traditional wire bonding process is used, then electrical connection is established, but manufacturing throughput decreases
Solution Approach 1:
The patent replaces the time-consuming mechanical wire bonding process with a faster direct deposition process. The deposition method can be performed more quickly and in parallel across multiple connection points, significantly increasing manufacturing throughput while reliably establishing electrical connections between trace lines
Solution Approach 2:
The invention performs the electrical connection formation as a preliminary step integrated into the manufacturing process flow, rather than as a separate post-processing step. By depositing the conductive material during the manufacturing sequence, the process enables faster production without compromising connection reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the complexity and cost of the wiring process, enhances reliability by eliminating long bond wires, and increases throughput by simplifying the semiconductor packaging process.
Implementation Method 1
heating the conductive layer from the first state to a second state, where the second state is different than the first state
Data Source
AI summary
Methods of forming conductive jumper traces for semiconductor devices and packages. Substrate is provided having first, second and third trace lines formed thereon, where the first trace line is between the second and third trace lines. The first trace line can be isolated with a covering layer. A conductive layer can be formed between the second and third trace lines and over the first trace line by a depositing process followed by a heating process to alter the chemical properties of the conductive layer. The resulting conductive layer is able to conform to the covering layer and serve to provide electrical connection between the second and third trace lines.