Flexible Conductive Label Heat Path for Semiconductor Packages
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Solution Overview
Problem
Semiconductor packages generate significant heat due to high performance and functionality, requiring effective heat dissipation to ensure operation stability and reliability, but existing solutions are inadequate in managing heat in limited spaces.
Innovation Solution
A semiconductor apparatus utilizing a flexible conductive label with a thermally-conductive layer and adhesive layers to transfer heat from the semiconductor package to a cover, enhancing heat dissipation by allowing the conductive label to be attached to both the package and the cover, even with height differences, and incorporating a thermal interface material for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional heat dissipation structure is used in limited space, then the semiconductor package can be mounted, but heat dissipation performance is insufficient
Solution Approach 1:
The conductive label extends beyond the planar surface of the semiconductor package in the vertical dimension, allowing heat transfer to occur not only from the top surface but also from the side surfaces of the package. This multi-dimensional heat dissipation approach overcomes the limitation of limited horizontal space while effectively transferring heat to the cover.
Solution Approach 2:
The conductive label is implemented as a flexible thin film structure that can conform to the contours of the semiconductor package and extend to the cover. This flexible film design allows effective heat transfer in limited spaces where rigid heat sinks cannot be accommodated, while maintaining good thermal contact through the adhesive layers.
2Reliability
If the cover completely surrounds the semiconductor package, then protection is improved, but heat dissipation path is blocked
Solution Approach 1:
The conductive label acts as an intermediary thermal pathway between the semiconductor package and the cover. Instead of blocking heat transfer, the cover is designed with a thermally conductive label that mediates the heat flow from the package through the adhesive layers to the cover, allowing the cover to provide protection while maintaining effective heat dissipation.
3Adaptability or versatility
If adhesive layers are used to attach the conductive label, then flexibility and attachment capability are improved, but thermal conductivity may be reduced
Solution Approach 1:
The adhesive layers are applied locally only at the interfaces between the conductive label and the bonding pads, rather than covering the entire surface. This localized adhesive application minimizes the thermal resistance introduced by adhesives while maintaining sufficient attachment capability, allowing the majority of the conductive label surface to provide efficient thermal conduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat generated by semiconductor packages, improving the thermal management of semiconductor apparatuses by allowing for flexible attachment and enhanced heat transfer, thereby enhancing operation stability and reliability.
Implementation Method 1
a thermal interface material (TIM) arranged on the conductive layer to vertically overlap the semiconductor package
Implementation Method 2
a thermally-conductive layer, which is attached to the semiconductor package by the first adhesive layer
Data Source
AI summary
A semiconductor apparatus includes: a system substrate; a semiconductor package mounted on the system substrate and having a first length in a first horizontal direction; a conductive label flexible and arranged on the semiconductor package, the conductive label including: a first adhesive layer contacting the semiconductor package; a thermally-conductive layer attached to the semiconductor package by the first adhesive layer and having a second length in the first horizontal direction greater than the first length; and a second adhesive layer contacting a portion of a surface of the conductive layer, the portion not vertically overlapping the semiconductor package; a thermal interface material (TIM) arranged on the conductive layer to vertically overlap the semiconductor package; and a cover including: a first cover portion vertically overlapping the semiconductor package and contacting the TIM; and a second cover portion to which the thermally-conductive layer is attached by the second adhesive layer.