Conductive Laminate Barrier Structure for Thin Copper Diffusion Control
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Solution Overview
Problem
Current copper diffusion barriers in integrated circuits, typically made from transition metal nitrides, are too thick for advanced ICs, leading to RC delay issues and performance degradation due to copper atom diffusion into silicon elements at low temperatures.
Innovation Solution
A conductive laminate with a diffusion barrier structure comprising a discontinuous modified layer formed using a silane with hydrophilic groups and a self-healing polymer barrier layer, such as polyvinyl alcohol, to obstruct copper atom diffusion into the substrate, reducing the barrier thickness and maintaining electrical reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a copper diffusion barrier is formed using conventional dry processes with transition metal nitride, then copper atom diffusion is obstructed, but the barrier layer becomes too thick causing RC delay problems
Solution Approach 1:
The patent uses a composite barrier layer structure consisting of a silane-modified dielectric layer combined with a copper diffusion barrier material. The silane modification creates a discontinuous modified layer that enhances barrier effectiveness while allowing the overall structure to be thinner than conventional single-material barriers
Solution Approach 2:
The patent changes the chemical and physical parameters of the dielectric layer by introducing silane groups with hydrophilic groups. This modification alters the layer's properties to provide better copper diffusion resistance at reduced thickness, transitioning from a conventional uniform dielectric to a chemically modified composite structure
2Length of stationary object
If the barrier layer thickness is reduced to less than 2 nm for advanced ICs, then RC delay is reduced, but copper atom diffusion into silicon elements increases
Solution Approach 1:
The patent applies preliminary modification to the dielectric layer by forming a silane-modified layer before depositing the copper diffusion barrier. This pre-modification creates a discontinuous modified layer that enhances copper diffusion resistance, allowing the subsequent barrier layer to be thinner while maintaining effectiveness
Solution Approach 2:
The silane-modified dielectric layer acts as an intermediary between the substrate and the copper diffusion barrier. This intermediate layer with hydrophilic groups enhances the overall barrier performance, enabling thinner copper barrier layers to achieve the same diffusion prevention as thicker conventional barriers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively prevents copper atom diffusion, maintaining electrical performance and reducing RC delay, while allowing for thinner barriers suitable for advanced ICs, even at elevated temperatures, and shortens the processing time required for barrier formation.
Implementation Method 1
immersing the substrate into a modifying solution including a silane with hydrophilic group to form a discontinuous modified layer on the surface of the substrate
Implementation Method 2
forming a barrier layer on the surface of the substrate and the discontinuous modified layer... to obstruct metal atoms in the conductive layer from diffusing into the substrate
Data Source
AI summary
A method for manufacturing a conductive laminate and a conductive laminate are provided. The method for manufacturing the conductive laminate includes steps of: providing a substrate having a surface; immersing the substrate into a modifying solution including a silane with a hydrophilic group to form a discontinuous modified layer on the surface of the substrate; forming a barrier layer on the surface of the substrate and the discontinuous modified layer, and forming a conductive layer on a surface of the barrier layer. The barrier layer includes a polymer, and the polymer is selected from the group consisting of: polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, polyethylene glycol, and any combination thereof.