Conductive Laminate Void Gradient for Heat Dissipation and Conductivity
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Solution Overview
Problem
Conductive laminates struggle to simultaneously achieve low volume resistivity and excellent heat dissipation properties, as existing methods often prioritize one property over the other due to uniform void ratios in the conductive ink film.
Innovation Solution
A conductive laminate with a specific void ratio distribution, where the first void ratio in a 50% region is between 15% to 50% and the second void ratio in a 10% region is lower, utilizing a conductive ink film with metals like silver, gold, platinum, nickel, palladium, and copper, and a manufacturing method involving multiple layers of conductive ink application and baking, optimizing void ratios through controlled application and baking processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a uniform void ratio is used in the conductive ink film, then the manufacturing process is simple, but the laminate cannot simultaneously achieve low volume resistivity and excellent heat dissipation properties
Solution Approach 1:
The patent applies local quality by creating different void ratios in different regions of the conductive ink film. The first void ratio (15-50%) in the lower region provides excellent heat dissipation properties, while the second void ratio (lower than the first) in the upper region ensures low volume resistivity. This spatial variation in void ratio distribution allows the laminate to simultaneously achieve both low volume resistivity and excellent heat dissipation properties that cannot be obtained with a uniform void ratio structure.
2Reliability
If the first void ratio is increased to improve heat dissipation, then heat dissipation properties are enhanced, but volume resistivity increases
Solution Approach 1:
The patent resolves this contradiction by applying local quality through spatial differentiation of void ratios. The first void ratio in the lower region is set at 15-50% to maximize heat dissipation properties, while the second void ratio in the upper region is controlled to be lower than the first to maintain low volume resistivity. This localized optimization allows each region to fulfill its specific functional requirement without compromising the other.
Solution Approach 2:
The patent segments the conductive ink film into two distinct regions with different void ratio characteristics. The lower region (first main surface side) has a higher void ratio optimized for heat dissipation, while the upper region (second main surface side) has a lower void ratio optimized for electrical conductivity. This segmentation allows independent optimization of heat dissipation and electrical properties in different spatial zones.
3Manufacturing precision
If the second void ratio is decreased to improve conductivity, then volume resistivity is reduced, but heat dissipation properties deteriorate
Solution Approach 1:
The patent applies local quality by assigning different void ratio values to different regions of the conductive ink film. The second void ratio in the upper region is controlled to be lower than the first void ratio to ensure low volume resistivity and good conductivity. Meanwhile, the first void ratio in the lower region is maintained at 15-50% to provide excellent heat dissipation properties. This localized differentiation resolves the contradiction by allowing each region to optimize for its primary function.
Solution Approach 2:
The patent segments the conductive ink film structure into two functional zones: an upper region with lower void ratio for electrical conductivity optimization, and a lower region with higher void ratio for heat dissipation optimization. This segmentation enables the laminate to achieve both low volume resistivity and excellent heat dissipation properties simultaneously by distributing different void ratio characteristics to appropriate spatial locations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate achieves both low volume resistivity and enhanced heat dissipation properties by controlling void ratios, improving conductivity and thermal management simultaneously.
Implementation Method 1
a conductive ink film provided on the base material... a first void ratio in a region that extends from a position being away from the first main surface toward the second main surface by a distance equivalent to 50% of a thickness of the conductive ink film to the second main surface is 15% to 50%
Implementation Method 2
a conductive laminate having a volume resistivity and excellent heat dissipation properties... a first void ratio in a region that extends from a position being away from the first main surface toward the second main surface by a distance equivalent to 50% of a thickness of the conductive ink film to the second main surface is 15% to 50%
Data Source
AI summary
Provided is a conductive laminate including a base material and a conductive ink film provided on the base material, in which a region that extends from a position being away from a first main surface toward a second main surface by a distance equivalent to 50% of a thickness of the conductive ink film to the second main surface has a first void ratio of 15% to 50%, and a second void ratio in a region that extends from the first main surface toward the second main surface to a position being away from the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film has a second void ratio which is smaller than the first void ratio.