Low-Moisture Conductive Laminate for High-Temperature Wire Stability
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Solution Overview
Problem
Conductive laminates used in touch panels and other applications experience disconnection of fine metal wires when exposed to high temperature environments, which is not effectively addressed by existing technologies.
Innovation Solution
A conductive laminate configuration is developed, featuring a fine metal wire with a blackening layer, intimate attachment layer, and metal conductive layer, surrounded by organic films with low moisture content, and optionally an inorganic film, to enhance adhesion and prevent disconnection at high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an organic film is arranged to cover the fine metal wire for protection, then the adhesion between the blackening layer and metal conductive layer is improved, but the fine metal wire disconnects in high temperature environments
Solution Approach 1:
The patent changes the moisture content parameter of the organic film from conventional levels to specifically less than 3.00%, and preferably less than 1.00%. This parameter change prevents disconnection in high temperature environments while maintaining adhesion, resolving the contradiction between strength and reliability.
Solution Approach 2:
The patent employs a composite structure consisting of multiple layers: blackening layer, intimate attachment layer, and metal conductive layer, all covered by low-moisture organic films. This composite material approach enhances both adhesion and high-temperature stability, simultaneously improving strength and reliability.
2Temperature
If the conductive laminate is allowed to stand in a high temperature environment, then the operational conditions are met, but disconnection of the fine metal wire occurs
Solution Approach 1:
The patent modifies the moisture content parameter of the organic film to less than 3.00% (preferably less than 1.00%), which fundamentally changes the film's thermal stability characteristics. This enables the conductive laminate to withstand high temperature environments without wire disconnection, simultaneously achieving temperature tolerance and reliability.
Solution Approach 2:
The patent applies low-moisture organic films as a protective cushioning layer before high temperature exposure occurs. This preventive measure cushions the fine metal wire against thermal stress, preventing disconnection before it happens and ensuring reliability under temperature variations.
Data Source
AI summary
A conductive laminate includes a first organic film, a fine metal wire arranged on the first organic film, and a second organic film arranged to cover the fine metal wire, in which the fine metal wire includes a blackening layer, an intimate attachment layer, and a metal conductive layer in order from a side of the first organic film, and moisture contents of the first organic film and the second organic film are less than 3.00%.