Conductive Laminated Structure for Narrow Bezel Displays

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Solution Overview

Problem

Metal nanowires have poor adhesive force and result in a relatively wide bezel design due to restricted contacting area with wirings, limiting their application in transparent conducting materials.

Innovation Solution

A conductive laminated structure comprising a substrate, an adhesion enhancement layer, a metal nanowire layer with a first opening exposing the enhancement layer, a wiring layer with a second opening overlapping the first, and an optical adhesive layer filling both openings to enhance adhesion and reduce the contacting area, allowing for a narrow bezel design and increased adhesive force.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If metal nanowires contact wirings through optical adhesive, then the structure is simple, but the contacting area is restricted causing wide bezel

Engineering Contradiction:
Improvestructure simplicityVSAvoidcontacting area
Core Design Contradiction:
Device complexityVSArea of moving object

Solution Approach 1:

The patent introduces a vertical stacking dimension by creating multiple metal nanowire layers at different heights, connected through conductive adhesive layers. This transforms the single-plane contact into a multi-layer three-dimensional structure, significantly increasing the total contacting area between nanowires and wirings while maintaining a compact overall design.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested structure where multiple metal nanowire layers are stacked vertically, with each layer containing nanowires that are positioned within the projection area of layers above or below. This nesting arrangement maximizes the use of vertical space and increases the effective contacting area without expanding the horizontal bezel width.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Device complexity

If metal nanowires are used directly, then the material is simple, but the adhesive force is poor

Engineering Contradiction:
Improvematerial simplicityVSAvoidadhesive force
Core Design Contradiction:
Device complexityVSStrength

Solution Approach 1:

The patent creates a composite structure by combining metal nanowires with conductive adhesive layers. The conductive adhesive serves as both a bonding agent to improve adhesion between nanowire layers and a conductive pathway to maintain electrical connectivity. This composite approach enhances the overall adhesive force while preserving the conductive properties needed for the transparent conducting film function.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The conductive adhesive layer acts as an intermediary between adjacent metal nanowire layers, providing both mechanical bonding to improve adhesion and electrical conduction to maintain conductivity. This intermediary layer resolves the adhesion problem of pure metal nanowires while preserving their electrical functionality.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS11510323B2Conductive laminated structure, a manufacturing method thereof, and a display panel
Publication Date: 2022.11.22 SUZHOU GOVISIONOX INNOVATION TECHNOLOGY CO LTD
  • US11510323B2 patent drawing
  • US11510323B2 patent drawing
  • US11510323B2 patent drawing

AI summary

The present application discloses a conductive laminated structure, a manufacturing method thereof, and a display panel. The conductive laminated structure provided by the present application comprises a substrate; an adhesion enhancement layer disposed on the substrate; a metal nanowire layer disposed on the adhesion enhancement layer and having a first opening to expose the adhesion enhancement layer; a wiring layer disposed on the metal nanowire layer and having a second opening at least partially overlapping the first opening to expose the adhesion enhancement layer; and an optical adhesive layer disposed on the wiring layer, filled in the second opening and the first opening and connected to the adhesion enhancement layer. Because the metal nanowire layer is in direct contact with the wiring layer, the conducting capability is enhanced, and a reduced contacting area is needed, so that the wiring layer can be relatively narrow.