Conductive Layer for Composite Substrate Coating

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Solution Overview

Problem

Composite materials used in aerospace and defense applications face issues with abrasive wear, limited thermal resistance, and the need for multiple intermediate layers for coating, which increases complexity, cost, and the risk of adhesion failures.

Innovation Solution

A composite material with a conductive layer comprising embedded filaments in a polymeric matrix, allowing direct deposition of coatings without intermediate layers, enhancing electrical conductivity and mechanical bonding through simultaneous curing of the substrate and conductive layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple intermediate layers are used for coating composite materials, then adhesion between layers can be improved, but device complexity and manufacturing time increase

Engineering Contradiction:
Improveadhesion between layersVSAvoidnumber of intermediate layers
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes the multiple intermediate layers (adhesive layer, nickel layer, metal alloy layer) from the coating structure, retaining only the essential conductive layer that provides both adhesion and electrical conductivity for electroplating. This extraction eliminates unnecessary complexity while maintaining the core functional requirements.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The conductive layer is designed to perform multiple functions simultaneously: it serves as an adhesive layer for bonding, a conductive layer for electroplating, and a structural layer for the final coating. This multi-functionality eliminates the need for separate intermediate layers, reducing device complexity while maintaining reliability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If multiple intermediate layers are used for coating composite materials, then coating adhesion can be improved, but manufacturing time and cost increase

Engineering Contradiction:
Improvecoating adhesionVSAvoidprocessing time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent extracts and eliminates the time-consuming steps of applying and curing multiple intermediate layers (adhesive layer, nickel layer, metal alloy layer), retaining only the essential conductive layer application step. This reduces manufacturing time significantly while maintaining coating adhesion through the conductive layer's inherent bonding properties.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent combines the functions of multiple separate layers into a single conductive layer that provides both adhesion and electrical conductivity. This merging eliminates the sequential processing steps required for multiple layers, reducing manufacturing time and cost while achieving the same or better performance.

Inventive Principle:
Principle #5Merging (Combining)

3Stability of the object's composition

If multiple intermediate layers are used for coating composite materials, then coating stability can be improved, but the minimum achievable thickness of surface coatings increases

Engineering Contradiction:
Improvecoating stabilityVSAvoidminimum coating thickness
Core Design Contradiction:
Stability of the object's compositionVSVolume of moving object

Solution Approach 1:

The patent removes the extra thickness contributed by multiple intermediate layers (adhesive layer, nickel layer, metal alloy layer), retaining only the essential conductive layer. This extraction reduces the minimum achievable thickness of the surface coating while maintaining stability through the conductive layer's optimized composition and bonding properties.

Inventive Principle:
Principle #2Taking out (Extraction)

4Strength

If electroplating is used for coating composite materials, then wear resistance and hardness can be improved, but the substrate must be electrically conductive which composite materials lack

Engineering Contradiction:
Improvewear resistance and hardnessVSAvoidelectrical conductivity of substrate
Core Design Contradiction:
StrengthVSAdaptability or versatility

Solution Approach 1:

The patent introduces a conductive layer as an intermediary between the non-conductive composite substrate and the electroplating process. This intermediate conductive layer provides the necessary electrical conductivity for electroplating while being bonded to the composite substrate, enabling wear-resistant and hard coatings on otherwise non-conductive materials.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent uses a composite conductive layer structure that combines conductive materials with adhesive properties, creating a material that bridges the gap between non-conductive composite substrates and electroplating requirements. This composite approach enables electroplating on composite materials while maintaining wear resistance and hardness.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the risk of adhesion failures, minimizes weight and cost, and improves the reliability of coatings by eliminating intermediate layers, ensuring better wear resistance and thermal properties.

Implementation Method 1

a conductive layer comprising one or more conductive filaments embedded in a polymeric matrix

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

simultaneous curing of the substrate and conductive layer

Methodology Applied
Scientific EffectPolymer curing: Chemical Bonding

Data Source

PatentUS20220251698A1Composite material
Publication Date: 2022.08.11 CROMPTON TECH GROUP
  • US20220251698A1 patent drawing
  • US20220251698A1 patent drawing

AI summary

A method of manufacturing a composite material includes forming a conductive layer comprising one or more conductive filaments embedded in a polymeric matrix, forming a composite substrate comprising a polymeric matrix with fibre reinforcement and curing the polymeric matrix of the conductive layer and the polymeric matrix of the composite substrate.