Conductive Layer Die Pad Projection for Package Heat Dissipation
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Solution Overview
Problem
The heat dissipation capabilities of electronic packages are inadequate due to the sealing of electrical elements, which restricts the dissipation of increasing heat generated by more powerful electronic products.
Innovation Solution
The die pad is made to project from the bottom surface of the sealant, enlarging the surface contact area with the outside, allowing for enhanced heat dissipation by facilitating direct heat conduction to the exterior.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the chip is fully sealed in the sealant, then the package structure is complete and protected, but the heat dissipation capability is reduced
Solution Approach 1:
The die pad is extracted from the fully sealed structure by making it project from the bottom surface of the sealant. This allows the die pad to be partially removed from the sealed volume, creating an external heat dissipation surface while maintaining the sealed protection for the chip and other internal components.
Solution Approach 2:
The die pad extends in the vertical dimension by projecting from the bottom surface of the sealant. This dimensional change creates additional surface area for heat dissipation in the direction perpendicular to the chip mounting plane, without compromising the horizontal sealing integrity.
2Temperature
If the die pad projects from the bottom surface of the sealant, then the heat dissipation ability is enhanced, but the manufacturing complexity increases
Solution Approach 1:
The die pad is formed with the intended projection geometry during the initial packaging process before the sealant is applied. By preparing the die pad structure in advance with the correct shape and dimensions, the subsequent sealing process becomes simpler and does not require additional complex steps to create the projection.
Solution Approach 2:
Only the die pad is given the projecting quality, while other components remain fully sealed. This localized modification focuses the structural change on the specific component that needs heat dissipation, avoiding unnecessary complexity in other parts of the package structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the heat dissipation properties of the package by increasing the surface contact area, enabling more efficient heat transfer from the chip to the outside environment.
Implementation Method 1
the heat dissipating property of the package is enhanced... enabling more efficient heat transfer from the chip to the outside environment
Data Source
AI summary
A package and a fabricating method thereof are provided. The package includes a conductive layer, a chip, a plurality of first pads, a plurality of bonding wires and a sealant. The conductive layer has a die pad and includes a plurality of wires. A path of each wire is substantially parallel to a supporting surface of the die pad. Each wire has an upper surface and a lower surface. The chip disposed on the supporting surface has a plurality of pads. The first pads are correspondingly formed on the upper surfaces of the wires. The bonding wires electrically connect the pads of the chip to the first pads. The sealant seals up the conductive layer, the first pads, the chip and the bonding wires, and exposes the lower surface of the conductive layer. The conductive layer projects from a bottom surface of the sealant.