Transparent Conductive Layer Grain Boundaries for Faster Etching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional transparent conductive layers have a low etching rate, which hinders productivity in etching processes such as wiring pattern formation and design.
Innovation Solution
A transparent conductive layer with a crystalline structure featuring grain boundaries that are open to the surface, allowing etching solutions to easily enter and peel off crystal grains, thereby increasing the etching rate. The layer is composed of tin-containing oxides for excellent transparency and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional transparent conductive layer with crystal grains is used, then the layer maintains structural integrity and electrical conductivity, but the etching rate is low which reduces productivity
Solution Approach 1:
The invention divides the continuous grain boundary structure into segmented sections by creating intermediate regions that are not in contact with the second main surface. This segmentation allows etching solution to access grain boundaries from multiple surfaces (first main surface and side surfaces), enabling efficient etching while maintaining the overall structural integrity and electrical conductivity of the transparent conductive layer during manufacturing
Solution Approach 2:
The invention applies local quality by creating specific regions with different characteristics: grain boundaries with intermediate regions that are accessible to etching solution, while other portions of the layer maintain continuous structure for electrical conductivity. The grain boundaries are selectively designed to have open end edges at the first main surface, creating localized etching pathways without compromising the overall layer structure
2Productivity
If the transparent conductive layer is etched for wiring pattern formation, then the design requirements are met, but the low etching rate increases processing time and reduces productivity
Solution Approach 1:
The invention performs preliminary action by pre-forming grain boundaries with intermediate regions during the layer formation process, creating built-in etching pathways before the actual wiring pattern etching is needed. This preliminary structuring of grain boundaries ensures that when etching is performed for wiring patterns, the etching solution can rapidly penetrate along the pre-formed grain boundaries, significantly reducing the actual etching process time and increasing productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The high etching rate of the transparent conductive layer enhances productivity in applications like touch sensors, light control elements, and image display devices by facilitating efficient etching processes.
Implementation Method 1
having a grain boundary in which two end edges in a cross-sectional view are open to the first main surface, and an intermediate region between both end edges is not in contact with the second main surface
Data Source
AI summary
A transparent conductive layer 3 includes a first main surface 5 exposed to the outside, and a second main surface 6 opposite to the first main surface 5 in a thickness direction. The transparent conductive layer 3 is single layer extending in a plane direction. The transparent conductive layer 3 has a first grain boundary 7 in which two end edges 23 in a cross-sectional view are open to the first main surface 5, and an intermediate region 25 between both end edges 23 is not in contact with the second main surface 6, and has a first crystal grain 31 partitioned by the first grain boundary 7 and facing only the first main surface 5.