Conductive Layer Trench Coating for Power Module Reliability
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Solution Overview
Problem
Power semiconductor modules face electrical failures and electron flow issues due to high electric field strengths in the gaps between sections of the first electrically conductive layer, which existing coatings may adversely affect by covering the top side of the layer.
Innovation Solution
A method involving forming a structured first electrically conductive layer on a dielectric insulation layer, creating trenches through the layer, applying a coating that covers the trench bottom and walls, and removing the mask layer without affecting the substrate's function.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a coating is applied to reduce electric field strength in the gaps between sections of the first electrically conductive layer, then electrical reliability is improved, but the coating may cover the top side of the layer and adversely affect electron flow and substrate function
Solution Approach 1:
The coating is applied selectively only in the gaps between sections of the first electrically conductive layer, not across the entire surface. This localized application reduces electric field strength where needed while leaving the top sides of the conductive sections uncovered, allowing electron flow to proceed normally without adverse effects from the coating material.
2Reliability
If existing coating methods are used to protect the conductive layer, then electrical failures are prevented, but the coating process becomes complex and may affect substrate function
Solution Approach 1:
A mask layer is applied to the substrate before the coating process. This mask layer defines the gaps between conductive sections and serves as a template, allowing the coating to be applied uniformly across the substrate while automatically limiting the coating to only the desired gap regions. After coating, the mask layer is removed, leaving the coating precisely in place. This preliminary masking step simplifies the overall process by eliminating the need for complex selective coating techniques.
Data Source
AI summary
A method includes forming a first electrically conductive layer on a first side of a dielectric insulation layer, forming a structured mask layer on a side of the first electrically conductive layer that faces away from the dielectric insulation layer, forming at least one trench in the first electrically conductive layer, said at least one trench extending through the entire first electrically conductive layer to the dielectric insulation layer, forming a coating which covers at least the bottom and the side walls of the at least one trench, and removing the mask layer after the coating has been formed.