Conductive Layer Layout for Higher-Yield Light-Emitting Circuits
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Solution Overview
Problem
Existing electronic device fabrication processes often result in defects due to the influence of subsequent processes, leading to a diminished yield in finished devices.
Innovation Solution
The electronic device incorporates a conductive layer between the substrate and light-emitting units, with portions of the conductive layer overlapping semiconductor layers. This configuration helps shield formed components from defects during subsequent processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If subsequent fabrication processes are applied to complete the electronic device, then the device can be finished and functional, but pre-existing elements and traces become susceptible to defects leading to diminished yield
Solution Approach 1:
The patent applies preliminary action by forming the conductive layer to overlap and shield pre-existing elements (semiconductor layers, traces, and other components) before subsequent fabrication processes are applied. This protective conductive layer is established in advance to prevent defects during later processing steps, thereby maintaining high yield while allowing complete device fabrication to proceed.
2Productivity
If a conductive layer is added to shield pre-existing elements, then defect generation is reduced and yield improves, but device complexity increases
Solution Approach 1:
The conductive layer serves multiple functions simultaneously: it acts as an electrical conductor for signal transmission, provides physical shielding to protect pre-existing elements from subsequent process defects, and can serve as a base layer for subsequent structures. This multi-functionality reduces the need for separate protective layers, thereby improving yield without proportionally increasing device complexity.
Solution Approach 2:
The patent merges the protective function with the conductive function by using the same conductive layer for both purposes. Instead of adding a separate protective coating, the conductive layer itself is configured to overlap and shield vulnerable elements, combining structure and function to minimize complexity while maximizing protection.
Data Source
AI summary
An electronic device includes a substrate, first and second light-emitting units disposed on the substrate, first and second driving circuits disposed on the substrate, and a conductive layer. The first driving circuit includes a first transistor for driving the first light-emitting unit. The second driving circuit includes a second transistor for driving the second light-emitting unit. The conductive layer is disposed between the substrate and the first light-emitting unit and between the substrate and the second light-emitting unit, and includes a first portion and a second portion connected to the first portion, where the first transistor includes a first semiconductor layer, the second transistor includes a second semiconductor layer, and in a normal direction of the substrate, the first portion at least partially overlaps the first semiconductor layer, and the second portion at least partially overlaps the second semiconductor layer. A yield of the electronic device can be improved.