Conductive Lid Waveguide Packaging for Low-Loss RF Signal Transmission
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Solution Overview
Problem
Existing semiconductor device packages face challenges in minimizing signal loss during RF signal transmission, particularly in wireless communication devices, where conventional methods fail to efficiently guide electromagnetic waves with minimal energy loss.
Innovation Solution
A semiconductor device package is designed with a substrate and a conductive lid that defines a waveguide with a cavity, allowing for efficient signal transmission between electronic components by restricting energy transmission to one direction, thereby minimizing signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional conductive lines are used for signal transmission, then the device structure is simple, but signal loss is high during RF signal transmission
Solution Approach 1:
The conductive lid is segmented into multiple regions including a ground region, signal transmission region, and isolation region. This segmentation creates distinct functional zones that guide electromagnetic waves through specific pathways while isolating interfering signals, thereby reducing signal loss without requiring complete structural redesign
Solution Approach 2:
The patent transitions from conventional two-dimensional planar conductive lines to a three-dimensional waveguide structure formed by the conductive lid with cavity regions. This dimensional change enables electromagnetic wave confinement and directional transmission, significantly improving signal integrity while maintaining manufacturing feasibility through standard semiconductor packaging processes
2Reliability
If waveguide structure is implemented to reduce signal loss, then signal transmission efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The conductive lid serves multiple functions simultaneously: it acts as an electromagnetic shield, defines the waveguide cavity structure, provides ground references, and creates isolation regions. This multi-functionality consolidates what would otherwise require separate components into a single element, improving signal integrity while simplifying the manufacturing process
Solution Approach 2:
The patent utilizes standard conductive materials and geometric parameters that are compatible with existing semiconductor packaging manufacturing processes. By adjusting parameters such as conductive lid thickness, cavity dimensions, and pattern geometry rather than fundamentally changing the manufacturing approach, the design achieves improved signal transmission while maintaining ease of manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The waveguide configuration achieves low signal loss transmission, especially for high-frequency signals, by guiding electromagnetic waves with minimal energy loss, outperforming conventional conductive lines and enhancing signal integrity between electronic components.
Implementation Method 1
The waveguide is configured to transmit a signal from a first electronic component to a second electronic component through the cavity
Data Source
AI summary
A semiconductor device package includes a substrate and a conductive lid. The conductive lid is disposed within the substrate. The conductive lid defines a waveguide having a cavity. The waveguide is configured to transmit a signal from a first electronic component to a second electronic component through the cavity.