Conductive Line-End Layout for Scaled IC Interconnect Connectivity

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Solution Overview

Problem

Existing methods of fabricating semiconductor integrated circuits (ICs) have not adequately addressed the challenges of scaling down while maintaining effective interconnects and dielectric materials for improved IC performance.

Innovation Solution

A method involving the formation of conductive lines with specific line-end structures, including a line-like portion and a line-end portion with a larger width, using a hard mask layer and dielectric trench etching to connect conductive features, enhancing the connectivity and integrity of interconnects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional fabrication methods are used for scaling down, then production efficiency increases and costs decrease, but interconnect connectivity and integrity deteriorate

Engineering Contradiction:

Improveproduction efficiencyVSAvoidinterconnect connectivity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The conductive line is segmented into a line-like portion and a line-end portion with different widths. The line-end portion has a larger width to improve connectivity and reduce electromigration effects, while the line-like portion maintains a narrower width for density. This segmentation allows the interconnect to function reliably at scaled dimensions while maintaining manufacturing efficiency.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different portions of the conductive line have different width characteristics. The line-end portion is locally widened to provide enhanced connectivity and lower resistance at critical connection points, while the line-like portion maintains standard width for optimal routing density. This local quality variation resolves the contradiction between connectivity and scaling.

Inventive Principle:

Principle #3Local quality

2Area of moving object

If geometry size is decreased to increase functional density, then more circuits fit per chip area, but interconnect performance and manufacturing precision become more challenging

Engineering Contradiction:

Improvechip area utilizationVSAvoidinterconnect fabrication precision

Core Design Contradiction:

Area of moving objectVSManufacturing precision

Solution Approach 1:

The conductive line is divided into segments with different width characteristics. The line-end portion is formed with a larger width to compensate for manufacturing variability and ensure reliable connectivity, while the line-like portion maintains narrower dimensions for high density. This segmentation allows each portion to be optimized for its specific function while accommodating manufacturing precision constraints.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The line-end portion is pre-formed with a larger width to anticipate and compensate for potential manufacturing variations and electromigration effects that may occur during device operation. This preliminary design choice ensures that even with scaled geometry and manufacturing tolerances, the interconnect maintains sufficient connectivity and reliability.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS12406878B2Integrated circuit with conductive line having line-ends

Publication Date: 2025.09.02 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor device is disclosed, including a plurality of conductive features disposed over a substrate. A dielectric layer separates the conductive features. A conductive line is provided, connecting a subset of the conductive features. The conductive line includes a line-like portion and a line-end portion.