Conductive Line Mask Assignment for RC and Resistivity Matching

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In multi-patterning technologies, the use of multiple masks to form conductive lines results in varying widths and resistivities, leading to inconsistent electrical behaviors in circuits, particularly affecting long conductive lines which impact the performance of electrical circuits like inverter rings and current mirrors.

Innovation Solution

Employing a two-mask approach in self-aligned double patterning (SADP) where a first mask forms conductive lines with a smaller width and a second mask forms lines with a larger width, reducing resistivity and RC constant, thereby improving the electrical performance by ensuring consistent current flow across similar circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple masks are used in multi-patterning technologies to form conductive lines, then the circuit complexity and design flexibility are improved, but the width consistency and electrical behavior uniformity deteriorate

Engineering Contradiction:
Improvecircuit design flexibilityVSAvoidconductive line width consistency
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent segments the conductive line formation process into multiple patterning steps using different masks, where each mask forms a specific subset of conductive lines. This allows different width assignments for different circuit functions while maintaining systematic control over the segmentation process

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by assigning different widths to different sets of conductive lines based on their specific circuit functions. Critical current-carrying lines receive optimized widths for low resistance, while non-critical lines use standard widths, achieving local optimization without compromising overall manufacturing consistency

Inventive Principle:
Principle #3Local quality

2Reliability

If different widths of conductive lines are formed using different masks, then the electrical performance optimization for specific circuits is improved, but the resistivity consistency and RC constant uniformity deteriorate

Engineering Contradiction:
Improveelectrical performance optimizationVSAvoidresistivity consistency
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent systematically changes the width parameter of conductive lines based on their electrical function. By controlling the width parameter within specific ranges for different circuit elements, the patent achieves optimized electrical performance while maintaining predictable resistivity characteristics through parameter standardization

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If multi-patterning technologies are used to form conductive lines, then the circuit functionality and performance tuning capability are improved, but the manufacturing process complexity increases

Engineering Contradiction:
Improveperformance tuning capabilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent employs preliminary action by pre-planning the segmentation of conductive lines into different width categories during the design phase. This preliminary classification guides the subsequent multi-patterning manufacturing steps, reducing on-the-fly decision complexity and streamlining the overall process

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS12165972B2Method of manufacturing conductive lines in a circuit
Publication Date: 2024.12.10 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US12165972B2 patent drawing
  • US12165972B2 patent drawing
  • US12165972B2 patent drawing

AI summary

A method includes identifying at least a first mask or a second mask, fabricating, by the first mask, a first conductive line, fabricating, by the second mask, a second conductive line, and fabricating, by the first mask, a third conductive line if a dimension of the first conductive line is larger than a corresponding dimension of the second conductive line, or fabricating, by the second mask, the third conductive line if the dimension of the first conductive line is less than the corresponding dimension of the second conductive line A first circuit element is coupled to a second circuit element by at least the third conductive line, and the first circuit element is separated from the second circuit element by a predetermined distance.