Conductive Line Printing via Laser Sintering
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Solution Overview
Problem
Current methods for printing conductive lines on substrates, such as inkjet deposition and laser writing, result in relatively thick lines and high material consumption, which are not suitable for high-density circuit boards due to low resolution and material inefficiency.
Innovation Solution
A combination of an inkjet printing element and a laser imaging element that sinter nano-particles of conductive material, allowing for the formation of narrower conductive lines by adjusting the laser spot size and removing unsintered ink, thereby enhancing conductivity and reducing material waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If inkjet deposition is used to print conductive lines, then material consumption is reduced, but line width is too thick for high-density circuit boards
Solution Approach 1:
The patent changes the physical state of the conductive material from liquid (inkjet deposited) to solid (sintered) by applying laser heating. This parameter change enables the material to transition from a thick, soft deposited layer to a narrow, dense sintered line, resolving the contradiction between material efficiency and line width precision
Solution Approach 2:
The patent replaces the mechanical/thermal processing steps (inkjet deposition followed by conventional drying and firing) with a laser-based sintering process. The laser selectively heats and sinteres the deposited material, enabling precise control over final line dimensions while maintaining material efficiency
2Manufacturing precision
If laser writing and etching are used to print conductive lines, then line width precision is improved, but material consumption increases
Solution Approach 1:
The patent applies preliminary inkjet deposition of conductive material before laser sintering. This preliminary action creates a distributed material pattern that can be selectively sintered, allowing precise line formation with minimal material consumption compared to direct laser writing
Solution Approach 2:
The patent uses laser heating to change the physical state of the deposited material from loose particles to sintered solid. This parameter change enables precise line width control through laser spot size while the inkjet deposition method ensures low material consumption
3Quantity of substance
If conventional inkjet printing is used, then material deposition is achieved, but resolution is insufficient for fine circuit details
Solution Approach 1:
The patent replaces conventional inkjet printing with a combination of inkjet deposition and laser sintering. The laser component provides the high resolution needed for fine circuit details by controlling the spot size and sintering process, while the inkjet system handles material deposition
Solution Approach 2:
The patent changes the resolution-limiting parameter of inkjet printing (droplet size) by introducing laser sintering. The laser spot size, which can be made much smaller than inkjet droplets, becomes the effective resolution determinant, enabling fine circuit details
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of narrower, more conductive lines with improved resolution and reduced material usage, suitable for high-density circuit boards, while optimizing the printing process for precise and efficient electronic component formation.
Implementation Method 1
an imaging element configured to sinter a first part of the pattern of conductive material
Implementation Method 2
a laser source adapted to sinter the deposited conductive material
Implementation Method 3
a printing element for printing a pattern of conductive material on the substrate
Data Source
AI summary
An apparatus (300) for printing conductive lines on a substrate includes a printing element (320) for printing a pattern of conductive material (204) on the substrate; and an imaging element (324) configured to sinter a first part of the pattern of conductive material.