Conductive Member Burring Prevention in Semiconductor Dicing
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Solution Overview
Problem
The ductile conductive film in semiconductor devices is prone to burring during cutting, leading to potential short-circuits when mounted on a mounting board, as the film is stretched and elongated, causing issues with mechanical cutting processes.
Innovation Solution
A manufacturing method involving a sealing resin layer formed between the semiconductor chip and the conductive member on the wiring board, which prevents the conductive film from being stretched during cutting by a dicing tool, thereby eliminating burrs and ensuring a secure connection without short-circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mechanical cutting is used to divide the base substrate into individual wiring boards, then productivity is improved, but the conductive film is stretched and burring occurs causing short-circuits
Solution Approach 1:
The patent applies preliminary action by forming a protective coating layer on the conductive film before the cutting process. This coating is applied in advance to prevent burring during subsequent mechanical cutting, thereby maintaining both productivity and reliability without requiring post-cutting cleanup or reducing cutting speed
2Ease of manufacture
If the conductive film is cut by the cutting tool, then the wiring boards are separated, but the ductile conductive film sustains burring on its downstream side
Solution Approach 1:
The patent introduces an intermediary protective coating layer between the cutting tool and the conductive film. This coating acts as a mediator that prevents direct contact and friction between the cutting tool and the ductile conductive film, thereby eliminating burring while maintaining ease of manufacture and improving manufacturing precision
3Productivity
If burrs are present on the conductive film, then the cutting process is complete, but the burrs may cause short-circuits when mounted on the mounting board
Solution Approach 1:
The patent applies preliminary anti-action by forming a protective coating on the conductive film before cutting to prevent burr formation. This preventive measure counteracts the harmful effect of burring before it can occur, thereby maintaining high productivity while eliminating short-circuit risks without requiring additional post-processing steps
Data Source
AI summary
A manufacture method for semiconductor device (1, 21) including: a sealing-resin-layer forming step of forming a sealing resin layer (7) on a conductive member (13) formed at lest on one surface of a base substrate (11) formed with a plurality of wiring boards (2) therein, the conductive member spanning a boundary between a respective pair of adjoining wiring boards; and a step of moving the base substrate and a cutting tool (B) relative to each other in a manner to allow the cutting tool to pass through the base substrate from the other surface (2b) opposite from the one surface thereof toward the one surface thereof, thereby cutting the base substrate along the boundary between the respective pair of adjoining wiring boards.