Conductive Member Module Resin Sealing Inductance
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Solution Overview
Problem
Conductive member modules face challenges in reducing parasitic inductance and enhancing insulation properties between facing conductive members, as existing manufacturing methods often result in contact between the members due to resin pressure, leading to insulation failures and increased manufacturing costs.
Innovation Solution
A manufacturing method for conductive member modules involves accommodating conductive members in a molding die with support members that apply a force away from each other, using a fluid resin to seal the members while preventing contact, and forming recesses to increase creepage distance and reduce inductance, with the resin partially present between inner surfaces and recesses to enhance insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin is injected into the die to seal the conductive members, then sealing is achieved, but the resin applies force in directions causing the conductive members to move toward each other and contact
Solution Approach 1:
Support members are positioned in advance within the die to counteract the force applied by the resin during injection. These support members apply a preliminary opposing force that prevents the conductive members from moving toward each other and contacting, thereby maintaining insulation properties while allowing effective sealing.
Solution Approach 2:
The support members function as a counterbalancing mechanism, providing a counter-force to the resin pressure. This counterweight approach ensures that the conductive members remain in their proper positions despite the force applied by the injected resin, preventing contact and insulation failure.
2Object-generated harmful factors
If the distance between conductive members is reduced to decrease parasitic inductance, then inductance is reduced, but the members are more likely to contact due to resin pressure
Solution Approach 1:
By pre-positioning support members in the die, the system creates a preliminary counter-force mechanism that becomes active during resin injection. This allows the conductive members to be placed closer together (reducing inductance) while the support members prevent them from contacting under resin pressure, thus resolving the contradiction between inductance reduction and insulation maintenance.
3Reliability
If support members are used to prevent contact between conductive members, then insulation is maintained, but device complexity increases
Solution Approach 1:
The support members are integrated into the die structure itself, combining the sealing function and the support function into a single unified tooling system. This merging eliminates the need for separate support mechanisms and simplifies the manufacturing process while maintaining insulation properties.
Solution Approach 2:
The die is designed to serve multiple functions: it provides the sealing cavity for resin injection and simultaneously incorporates support members that prevent conductive member contact. This multi-functionality reduces the need for additional specialized components and simplifies the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces parasitic inductance and enhances insulation properties by preventing contact between conductive members, allowing for a more efficient sealing process with reduced manufacturing costs and improved insulation performance.
Implementation Method 1
a sealing step of injecting a fluid resin into the die to seal the pair of conductive members
Data Source
AI summary
Performed are an accommodation step of accommodating a pair of conductive members in a die, a sealing step of injecting a resin to seal the conductive members, and an extraction step of extracting a conductive member module. In the sealing step, the conductive members are sealed while a force is applied by the resin injected into the die to the individual conductive members in directions away from each other, and the individual conductive members are supported by support members disposed outside.