Conductive Micro Pin Fabrication via Electroplating
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Solution Overview
Problem
Existing micro pin manufacturing techniques face challenges in producing micro pins with very small sizes, specific aspect ratios, and irregular shapes due to mold limitations, leading to issues like uneven incisions and frequent mold damage during reflow soldering.
Innovation Solution
A method involving a substrate with a release layer and pattern layer, where micro pins are formed using electroplating and subsequent etching processes to achieve precise dimensions and shapes, allowing for the creation of micro pins with lengths and widths less than 100 μm and 80 μm respectively, and various geometrical configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional mold-based micro pin manufacturing is used, then manufacturing process is simple, but manufacturing precision deteriorates due to inability to produce micro pins with very small sizes and specific aspect ratios
Solution Approach 1:
The patent replaces the conventional mechanical mold-based fabrication system with an electrochemical system consisting of electroplating and etching processes. This substitution enables precise control of micro pin dimensions and shapes at scales less than 100 μm × 80 μm, achieving high manufacturing precision while avoiding mold limitations and damage issues
Solution Approach 2:
The patent utilizes controllable electrochemical parameters (current density, plating time, etching conditions) to precisely regulate micro pin formation. By adjusting these parameters, the process achieves accurate control over micro pin size, aspect ratio, and geometric shape, resolving the contradiction between precision and complexity
2Reliability
If mold-based micro pin fabrication is used, then process is straightforward, but reliability deteriorates due to uneven incisions and frequent mold damage during reflow soldering
Solution Approach 1:
The patent eliminates the mechanical mold system entirely, replacing it with electrochemical fabrication. This removes the source of mold damage during reflow soldering and produces micro pins with uniform, damage-free surfaces, significantly improving reliability while maintaining manufacturing feasibility through automated electrochemical processes
Solution Approach 2:
The patent employs consumable electrochemical cells and disposable pattern layers rather than expensive, durable molds. This approach accepts shorter-lived fabrication components but eliminates the recurring damage and replacement costs associated with molds, improving overall process reliability
3Reliability
If solder bumps with large size are used in PoP packaging, then yield is excellent, but bridge risk increases when pitch decreases
Solution Approach 1:
The patent enables precise control of micro pin dimensions through electrochemical parameters, allowing optimization of pin size and pitch to achieve both high yield and low bridge risk. The controllable fabrication process produces consistent, uniform micro pins that maintain reliability at reduced pitches
Solution Approach 2:
The patent creates micro pins with optimized local geometric properties (aspect ratio, corner rounding, surface uniformity) that improve mechanical strength and electrical performance. These localized quality enhancements reduce bridge risk while maintaining packaging yield
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the fabrication of micro pins with precise dimensions and shapes, suitable for smaller technology nodes, reducing the risk of collapse during reflow soldering and improving manufacturing efficiency by minimizing mold damage and uneven incisions.
Implementation Method 1
micro pins are formed using electroplating
Implementation Method 2
subsequent etching processes to achieve precise dimensions and shapes
Data Source
AI summary
A conductive micro pin includes a body having a first end surface, a second end surface, a first side surface connecting the first end surface and the second end surface, and a first corner between the first end surface and the first side surface, in which the first side surface is substantially flat, and the first corner is substantially rounded.