Electrical Conductive Module With Interposed Grounding Holes
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Solution Overview
Problem
Existing electrical conductive modules for connecting motherboards to external circuits have complex structures and high production costs due to the need for a three-layer substrate with an adhesive section.
Innovation Solution
An electrical conductive module comprising a circuit board with upper and lower pads connected via through holes and printed wires, eliminating the need for an adhesive section, and using conducting posts with soldering and mating ends to directly connect with the circuit board, while interposing through holes between pads to reduce crosstalk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a three-layer substrate with adhesive section is used to connect upper and lower pads, then structural stability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent removes the adhesive section from the substrate structure entirely. Instead of using a three-layer substrate with adhesive, the invention uses a simplified single-layer substrate where conducting posts directly connect upper and lower pads through the substrate thickness, eliminating the need for adhesive bonding layers and reducing structural complexity while maintaining electrical connectivity and mechanical stability
Solution Approach 2:
The patent merges the functions of the substrate and connection structure into a single integrated component. The conducting posts are directly formed on or embedded in the substrate, combining the substrate's mechanical support function with the electrical connection function, thereby eliminating the need for separate adhesive layers and reducing overall device complexity
2Stability of the object's composition
If a three-layer substrate with adhesive section is used to connect upper and lower pads, then structural stability is improved, but manufacturing cost increases
Solution Approach 1:
The patent removes the adhesive section from the substrate structure entirely. Instead of using a three-layer substrate with adhesive, the invention uses a simplified single-layer substrate where conducting posts directly connect upper and lower pads through the substrate thickness, eliminating the need for adhesive bonding layers and reducing structural complexity while maintaining electrical connectivity and mechanical stability
Solution Approach 2:
The patent employs a simplified substrate structure that can be manufactured using standard, cost-effective PCB fabrication processes. By eliminating the need for multi-layer lamination and adhesive application steps, the manufacturing process becomes simpler and less expensive, making the product more economically viable
3Area of stationary object
If pads are closely arranged for compact design, then area is reduced, but crosstalk between adjacent pads increases
Solution Approach 1:
The patent introduces conducting through-holes as intermediary elements between adjacent pads. These through-holes serve as shielding structures that electrically ground or reference the space between adjacent signal paths, acting as a mediator that prevents electromagnetic coupling and crosstalk between closely spaced pads while allowing the pads to remain in a compact arrangement
Solution Approach 2:
The patent applies local shielding using conducting through-holes positioned strategically between adjacent pads. This creates localized electromagnetic shielding zones around each pad, providing targeted crosstalk reduction in critical areas while maintaining the overall compact layout. The shielding is applied locally where needed rather than requiring universal spacing increases
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the structure, reduces production costs, and enhances connectivity and signal integrity by eliminating the adhesive section and crosstalk, allowing for efficient power and signal transmission between the motherboard and external circuits.
Implementation Method 1
the upper side pad and the lower side pad in each pair are electrically connected together via a connecting through hole and printed wires
Implementation Method 2
a plurality of conducting posts, which each have a soldering end and a mating end opposite to each other in the up-down direction, the soldering end is soldered to the upper side pad on the circuit board correspondingly
Implementation Method 3
the soldering end is soldered to the upper side pad on the circuit board correspondingly
Data Source
AI summary
An electrical conductive module comprises: a circuit board, which has an upper side and a lower side opposite to each other in an up-down direction, the upper side of the circuit board is provided with a plurality of upper side pads, the lower side of the circuit board is provided with a plurality of lower side pads, the lower side pads and the upper side pads are provided in pairs, the lower side pad and the upper side pad in each pair are electrically connected together via a connecting through hole and printed wires which are provided alongside; the circuit board is provided with a plurality of conducting through holes for interposing the lower side pads and the upper side pads in different pairs; and a plurality of conducting posts, which each have a soldering end and a mating end opposite to each other in the up-down direction, the soldering end is soldered to the upper side pad on the circuit board correspondingly. The present disclosure can simplify structure and reduce production cost.