Conductive Mold Compound for Semiconductor EMI Shielding
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Solution Overview
Problem
Current semiconductor device packaging techniques are costly and complex, and lack a universal, reliable method to effectively shield against electromagnetic (EM) and radio frequency (RF) interference, which can adversely affect device performance.
Innovation Solution
A conductive shielding layer is applied to the top and sides of encapsulated semiconductor device packages, electrically connected to a grounded conductive component, providing a cost-effective and reliable solution for EM and RF interference shielding across various device types.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding layer is applied over the encapsulated device package with external grounding connection, then EM/RF shielding effectiveness is improved, but packaging cost and complexity increase
Solution Approach 1:
The patent combines the shielding layer application with the existing encapsulation process by integrating the conductive shielding material into the mold compound itself. This merging of functions eliminates the need for separate shielding layers and external grounding connections, reducing packaging complexity while maintaining EM/RF shielding effectiveness.
Solution Approach 2:
The patent creates a universal shielding solution where the mold compound serves multiple functions: structural encapsulation, electrical grounding, and EM/RF shielding. By making the encapsulant itself conductive and grounding it to the substrate ground, the system achieves multi-functionality that eliminates separate shielding components.
2Object-affected harmful factors
If a shielding layer is applied over the encapsulated device package with external grounding connection, then EM/RF shielding effectiveness is improved, but packaging cost increases
Solution Approach 1:
The patent merges the shielding function with the encapsulation material, eliminating the need for separate shielding layers and external grounding components. This integration reduces the number of manufacturing steps and materials required, thereby lowering packaging costs while maintaining shielding effectiveness.
Solution Approach 2:
The conductive mold compound serves multiple purposes: structural encapsulation, electrical grounding, and EM/RF shielding. This multi-functionality eliminates the need for additional shielding components and their associated costs, making the solution more cost-effective.
3Object-affected harmful factors
If conventional shielding techniques are used, then some level of EM/RF protection is achieved, but adaptability to various device package types is limited
Solution Approach 1:
The patent creates a universally applicable shielding solution by integrating the conductive shielding property directly into the mold compound material itself. This approach can be applied to any device package type that uses encapsulation, making it highly adaptable and versatile across different semiconductor packaging configurations.
Solution Approach 2:
The patent changes the electrical conductivity parameter of the mold compound material to achieve shielding. By selecting conductive or semi-conductive filler materials and adjusting their concentration, the shielding effectiveness can be tuned while maintaining compatibility with various package types and processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects semiconductor devices from external EM and RF interference while preventing radiation, enhancing device performance and reducing packaging complexity and costs.
Implementation Method 1
A conductive shield layer is formed over an encapsulated semiconductor device package to shield the package from electromagnetic (EM) and/or radio frequency (RF) interference from external sources
Data Source
AI summary
An encapsulated semiconductor device package with an overlying conductive EMI or RFI shield in contact with an end of a grounded conductive component at a lateral side of the package, and methods of making the semiconductor device package.