Conductive Molding for Electronic Circuit Package Shielding
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Solution Overview
Problem
Conventional electronic circuit packages face challenges in achieving high shielding characteristics while maintaining a reduced height, as metal casings with holes do not provide sufficient shielding and are not connected to the substrate's ground pattern.
Innovation Solution
An electronic circuit package design featuring a substrate with a power supply pattern exposed to the surface, a conductive molding member that covers and contacts the power supply pattern, and optional additional shielding layers such as a metal film or magnetic film, enhancing electromagnetic and magnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal casing is used to cover the entire structure, then shielding characteristics are improved, but reduction in height becomes difficult
Solution Approach 1:
The patent extracts the shielding function from a separate metal casing and integrates it into the molding member itself by adding conductive filler material. This eliminates the need for an additional external shielding layer, thereby reducing the overall height while maintaining shielding effectiveness.
Solution Approach 2:
The patent combines the shielding function with the molding member by incorporating conductive filler material into the resin. This merging of functions allows the molding member to serve both as structural encapsulation and as electromagnetic shielding, eliminating the need for a separate metal casing and reducing height.
2Ease of manufacture
If a metal casing with holes is used, then ease of manufacture is improved, but shielding effect becomes insufficient
Solution Approach 1:
The patent changes the key parameter of conductivity by incorporating conductive filler material (such as metal powder or conductive carbon) into the molding resin. This transforms the insulating molding material into a conductive composite that provides effective electromagnetic shielding, achieving sufficient shielding effect without requiring a metal casing with holes.
3Object-affected harmful factors
If the occupying ratio of the power supply pattern is increased, then shielding characteristics are enhanced, but area for other wiring patterns is reduced
Solution Approach 1:
The patent applies local quality by concentrating the power supply pattern at specific locations (corner portions or side portions of the substrate) rather than distributing it uniformly. This localized placement provides effective shielding at critical areas while minimizing interference with other wiring patterns and maintaining sufficient area for other circuit elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved shielding characteristics by increasing the occupying ratio of the power supply pattern and using conductive and magnetic materials, reducing volume resistivity and thermal expansion, and preventing faulty short-circuits, while allowing for reduced height and stable potential.
Implementation Method 1
the molding member has conductivity, so that a magnetic shielding function can be obtained by the molding member itself
Implementation Method 2
an electromagnetic shielding using a conductive paste or a plating or sputtering method has been proposed and put into practical use, and higher shielding characteristics are required in the future
Data Source
AI summary
Disclosed herein is an electronic circuit package that includes a substrate having a power supply pattern, an electronic component mounted on a surface of the substrate; and a molding member having conductivity that covers the surface of the substrate so as to embed the electronic component therein. The power supply pattern includes a first power supply pattern exposed to the surface of the substrate, and the molding member contacts the first power supply pattern.