Conductive Nanoparticle Circuit Formation for High-Density Mounting
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Solution Overview
Problem
Existing methods for packaging electronic components on circuit patterns face challenges with positional deviation and precision variations due to surface tension in solder paste and limitations in pattern size and formability with bump balls, hindering high-density mounting.
Innovation Solution
A method involving the application of conductive nanosized particles with an insulating material on a substrate, followed by light irradiation to form a circuit pattern directly connected to electronic component electrodes, eliminating the need for additional bonding agents and allowing precise high-density circuit formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder paste is used as bonding agent, then electrical connection is established, but positional deviation occurs due to surface tension forces pulling the electronic component
Solution Approach 1:
The patent removes the bonding agent (solder paste) from the system entirely, replacing it with a direct conductive pattern formed by sintered metal particles. This extraction eliminates the surface tension forces that cause positional deviation during solder paste melting, while still achieving electrical connection through the conductive pattern that is formed simultaneously with component mounting.
Solution Approach 2:
The patent merges the circuit pattern formation process with the component mounting process into a single operation. The conductive pattern is formed by irradiating metal particle-coated areas with laser or other energy sources after the component is placed, eliminating the need for separate bonding steps and preventing positional deviation caused by thermal and mechanical processes.
2Manufacturing precision
If circuit pattern is designed with larger pattern gap to accommodate positional deviation, then mounting precision is maintained, but high-density mounting is hampered
Solution Approach 1:
The patent performs preliminary coating of metal particles on the substrate in the exact positions where conductive patterns are needed, before component mounting. This preliminary action allows the circuit pattern to be formed precisely at the desired location with minimal gap, enabling high-density mounting while maintaining mounting precision through subsequent selective sintering.
3Manufacturing precision
If conventional copper-foil masking and etching is used to form circuit pattern, then circuit pattern is formed, but production process becomes complicated and time consuming
Solution Approach 1:
The patent replaces the mechanical copper-foil masking and etching system with a deposition and sintering system. Instead of mechanically removing copper foil through etching, metal particles are deposited in desired patterns and then sintered using laser or other energy sources. This substitution simplifies the production process by eliminating multiple masking, etching, and cleaning steps while achieving precise circuit pattern formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces positional deviations and enables high-density mounting of electronic components with improved precision and reduced production complexity, as the circuit pattern is formed and connected in a single step using light irradiation.
Implementation Method 1
the film is irradiated with light in a predetermined pattern, from the back surface of the optically transparent substrate, the conductive nanosized particles are sintered by the light
Implementation Method 2
the conductive nanosized particles are sintered by the light, and a layer is formed by sintering the conductive nanosized particle in the predetermined pattern
Data Source
AI summary
A method for producing an electronic device capable of connecting an electronic component precisely with a high-density circuit pattern includes applying a solution wherein conductive nanoparticles with a particle diameter of less than 1 μm and an insulating material are dispersed, or applying a solution wherein the conductive nanoparticles are coated with an insulating material layer, to a surface of an optically transparent substrate in a desired shape. A film of the conductive nanoparticles coated with the insulating material is formed. The electronic component is mounted on the film. The film is irradiated with light from a backside surface of the optically transparent substrate, and the light sinters the conductive nanoparticles. Accordingly, a first circuit pattern connected to electrodes of the electronic component is formed, and the first circuit pattern is adhered to the electrodes of the electronic component.