Conductive Connector with Nickel Alloy Layer for Glass Substrates
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Solution Overview
Problem
Establishing reliable electrically conductive connections between metal and glass is challenging due to differences in thermal coefficients of expansion, which can cause glass to break or crack during soldering, especially in applications like vehicle windows exposed to extreme temperatures.
Innovation Solution
A method involving a two-layer connector with a copper layer and a nickel alloy layer, where the nickel alloy has a thermal expansion coefficient closer to glass, reducing stress and using a solder with high indium content to minimize cracking, and applying pressure and heat for bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a soldered connection is established between metal and glass, then electrical conductivity is achieved, but the glass is likely to break or crack due to thermal expansion differences
Solution Approach 1:
The patent employs a composite connector structure consisting of a copper base layer providing electrical conductivity and a nickel alloy overlay layer with matched thermal expansion properties. This composite material approach allows the connector to simultaneously achieve excellent electrical conductivity while accommodating thermal expansion differences between the metal and glass, thereby preventing glass cracking during soldering and under thermal stress.
Solution Approach 2:
The patent changes the thermal expansion parameter of the connector by selecting a nickel alloy with specific compositional ratios (8-15% nickel, 0.5-2.0% manganese, 0.5-2.0% zinc, balance copper) that provide thermal expansion characteristics intermediate between copper and glass. This parameter adjustment enables the connector to bridge the thermal expansion gap, reducing stress on the glass substrate during temperature variations.
2Reliability
If extreme temperatures are applied to the glass-metal connection, then electrical connection is maintained, but stress on the glass increases due to thermal expansion differences
Solution Approach 1:
The composite connector structure with copper base and nickel alloy overlay provides a gradual transition in thermal expansion coefficients, reducing the abrupt stress concentration at the glass-metal interface. The nickel alloy layer acts as a buffer that accommodates differential thermal expansion, thereby maintaining connection stability while minimizing thermal stress transmission to the glass during extreme temperature conditions.
Solution Approach 2:
The patent explicitly utilizes thermal expansion principles by selecting materials with complementary thermal expansion properties. The nickel alloy overlay layer has thermal expansion characteristics that are intermediate between copper and glass, allowing it to expand and contract at rates that reduce the differential stress between the metal connector and glass substrate during temperature cycling, thereby preventing glass failure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a reliable electrical connection while significantly reducing the likelihood of glass cracking during soldering and under temperature exposure, maintaining the conductivity of copper while minimizing stress on the glass substrate.
Implementation Method 1
The first material has a first coefficient of thermal expansion and the second material has a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion
Implementation Method 2
bonding the first and second layers together
Implementation Method 3
applying pressure and heat for bonding
Implementation Method 4
A layer of solder is applied to the first and second layers such that the layer of solder covers the second layer and portions of the first layer that are exposed
Data Source
Figure 1
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AI summary
An illustrative example method of making an electrically conductive connector (20) comprising a first material and a second material, includes situating a layer (42) comprising the second material at least partially within at least one layer (40) comprising the first material and bonding the layers together. The first material has a first coefficient of thermal expansion and the second material has a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion.