Conductive Metal Board Package Layout for Shielding and Heat Dissipation
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Solution Overview
Problem
Existing package structures for high-performance wireless communication and automotive chips face inadequate heat dissipation efficiency despite effective electromagnetic shielding, which hampers their performance and reliability.
Innovation Solution
A package structure comprising a circuit board with a mold sealing layer, a conductive metal board, and a conductive layer, where the conductive metal board is positioned adjacent to electronic elements for heat absorption and the conductive layer is electrically connected to the metal board and ground element, enhancing both electromagnetic shielding and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If existing package structure focuses on electromagnetic shielding capability, then electromagnetic shielding is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The package structure is segmented into distinct functional components: a mold sealing layer for electromagnetic shielding, a conductive metal board for heat dissipation, and a conductive layer for electrical connection. This segmentation allows each component to optimize its specific function without compromising the other, resolving the contradiction between electromagnetic shielding and heat dissipation efficiency
Solution Approach 2:
The package structure integrates multiple functions into a unified system: the mold sealing layer provides electromagnetic shielding while the conductive metal board provides heat dissipation, and the conductive layer provides electrical connection. This multi-functionality approach allows the package to simultaneously achieve electromagnetic shielding and heat dissipation without trade-offs
2Ease of manufacture
If conductive metal board and conductive layer are integrated as one component, then manufacturing is simplified, but electromagnetic shielding and heat dissipation performance deteriorates
Solution Approach 1:
The conductive metal board and conductive layer are segmented as independent components with distinct functions. The conductive metal board is specifically designed for heat dissipation with high thermal conductivity, while the conductive layer is designed for electrical connection and electromagnetic shielding. This segmentation ensures optimal performance of each function while maintaining manufacturing feasibility through separate processing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation efficiency while maintaining electromagnetic shielding capabilities, thereby enhancing the performance and reliability of the chips.
Implementation Method 1
the conductive metal board is disposed on the top surface and adjacent to the first electronic element
Implementation Method 2
the package structure has the ability of electromagnetic shielding
Data Source
AI summary
A package structure and a manufacturing method for the same are provided. The package structure includes a circuit, a mold sealing layer, a conductive metal board, and a conductive layer. The circuit board includes a substrate and a first electronic element disposed on the substrate. The mold sealing layer is disposed on the substrate and covers the first electronic element. The mold sealing layer has a top surface, a bottom surface corresponding to the top surface, and a side surface connected between the top surface and the bottom surface. The conductive metal board is disposed on the top surface and adjacent to the first electronic element. The conductive layer is disposed on the side surface and electrically connected to the conductive metal board. The conductive metal board and the conductive layer are each an independent component.