Conductive Pad Recess Structure for Precise Bonding Alignment
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Solution Overview
Problem
The miniaturization and high density of electronic elements in devices lead to alignment errors during bonding, resulting in poor electrical performance and reliability due to displacement or production errors in conventional electronic devices.
Innovation Solution
An electronic device design featuring a conductive pad with an accommodating recess, where the width of the bottom surface is greater than the opening, improves alignment accuracy by embedding at least a portion of the bonding element within the recess, enhancing the electrical connection between the conductive pad and the electronic unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods are used for connecting electronic elements, then the bonding process can be completed, but alignment errors and displacement occur leading to poor electrical performance and reliability
Solution Approach 1:
The accommodating recess is pre-formed on the conductive pad before the bonding element is placed. This preliminary structural preparation guides the bonding element into the correct position, preventing alignment errors during the bonding process and ensuring accurate electrical connection.
Solution Approach 2:
The accommodating recess acts as an intermediary structure between the conductive pad and the bonding element. It provides a physical guide and constraint mechanism that ensures precise alignment, mediating the connection process to achieve both good electrical performance and manufacturing precision.
2Area of stationary object
If the conductive pad size is reduced for miniaturization, then device density increases, but alignment errors become more significant affecting electrical performance
Solution Approach 1:
The accommodating recess creates a localized precision feature on the conductive pad. While the overall pad size is reduced for miniaturization, the recess provides a concentrated alignment reference point that maintains manufacturing precision even in smaller dimensions, enabling both miniaturization and accurate alignment.
3Reliability
If conventional bonding structures are used, then simple construction is maintained, but displacement errors occur reducing device reliability
Solution Approach 1:
The conductive pad structure is segmented by adding the accommodating recess as a distinct feature. This segmentation creates a dedicated alignment zone that prevents displacement errors and improves reliability, while the overall structure remains relatively simple with just one additional geometric feature.
Data Source
AI summary
An electronic device including a circuit structure, a bonding element and an electronic unit is disclosed. The circuit structure includes a conductive pad, and the conductive pad has an accommodating recess. At least a portion of the bonding element is disposed in the accommodating recess. The electronic unit is electrically connected to the conductive pad through the bonding element. The accommodating recess has a bottom surface and an opening opposite to the bottom surface, and a width of the bottom surface is greater than a width of the opening.