Conductive Pad Groove for Chip Adhesion
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Solution Overview
Problem
The challenge in electronic devices is to enhance the adhesion between a chip and a conductive pad on a substrate, as existing methods fail to ensure stable bonding and optimal conductivity.
Innovation Solution
The design incorporates a first conductive pad with a groove on a substrate, electrically connected to a second conductive pad on the chip, where the groove structure and material composition increase adhesion and conductivity by forming intermetallic compounds during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional conductive pad structure is used, then the device structure is simple, but the adhesion between chip and substrate is insufficient
Solution Approach 1:
The conductive pad is segmented into multiple layers including a first conductive pad on the substrate, a second conductive pad on the chip, and an intermediate conductive pad between them. This segmentation allows each layer to be optimized for specific functions (adhesion, conductivity, mechanical support) thereby resolving the contradiction between improving adhesion and maintaining structural simplicity.
Solution Approach 2:
The conductive pad structure uses composite materials with different properties at each layer. The first conductive pad on the substrate has optimized composition for adhesion, while the intermediate pad has optimized composition for conductivity and mechanical strength. This composite approach enables simultaneous improvement of adhesion and structural performance without excessive complexity.
2Strength
If the conductive pad area is increased to improve adhesion, then the adhesion strength increases, but the area available for other circuit elements decreases
Solution Approach 1:
By segmenting the conductive pad into multiple functional layers, the vertical space is utilized more efficiently. This allows adequate adhesion strength to be achieved through layered construction rather than increasing the horizontal footprint, thereby preserving substrate area for other circuit elements.
Solution Approach 2:
The solution transitions from a two-dimensional expansion (increasing pad area on the substrate surface) to a three-dimensional approach (stacking multiple conductive pad layers vertically). This dimensional change achieves the required adhesion strength without consuming additional substrate area, resolving the contradiction between adhesion strength and available circuit area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the stability of chip bonding to the substrate and improves conductivity between the chip and substrate, leading to improved adhesion and electrical performance.
Implementation Method 1
the groove structure and material composition increase adhesion and conductivity by forming intermetallic compounds during bonding
Data Source
AI summary
An electronic device includes a substrate, a first conductive pad and a chip. The first conductive pad is disposed on the substrate. The chip includes a second conductive pad electrically connected to the first conductive pad, and the first conductive pad is disposed between the substrate and the second conductive pad. The first conductive pad has a first groove.