Conductive Pad Structure With Partitioned Openings Against Peeling
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Solution Overview
Problem
Existing conductive structures in electronic devices face issues with adhesion between top and bottom pads due to defects or particle residue, leading to peeling, especially when subjected to external forces.
Innovation Solution
A conductive structure comprising a substrate with a first and second conductive layer separated by an insulating layer, featuring openings for electrical connection and a partition between them that acts as a peeling stopper, optimizing adhesion and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive structure with top pad and bottom pad is used for electrical connection, then electrical connectivity is achieved, but adhesion between pads is reduced due to defects or particle residue causing peeling
Solution Approach 1:
The patent introduces a partition structure as an intermediary element between the top pad and bottom pad. This partition acts as a mediator that prevents direct contact between conductive layers in certain regions, thereby stopping the propagation of peeling forces while maintaining electrical connectivity through designated opening regions. The partition serves as a mechanical barrier that interrupts the peeling path without compromising the overall electrical function.
Solution Approach 2:
The conductive structure is segmented into multiple functional regions: conductive regions for electrical connection and partition regions for mechanical support and peeling prevention. By dividing the structure into these distinct segments, the patent allows different regions to perform specialized functions - the openings maintain conductivity while the partitions provide structural reinforcement and prevent peeling propagation.
2Reliability
If multiple conductive layers are stacked for electrical connection, then conductivity is improved, but adhesion between layers is reduced leading to peeling under external force
Solution Approach 1:
The partition structure serves as a mechanical intermediary that distributes and absorbs external forces applied to the stacked conductive layers. By introducing this intermediate structural element, the patent prevents direct stress transmission between the top and bottom pads, thereby reducing the likelihood of layer delamination while preserving electrical connectivity through the opening regions.
Solution Approach 2:
The conductive structure employs a composite design combining conductive materials (for electrical connection) and partition materials (for mechanical strength). This composite structure integrates materials with different properties - conductive layers for electrical function and partition structures for mechanical reinforcement - creating a multi-functional system that simultaneously achieves conductivity and adhesion resistance.
3Reliability
If conductive layers are separated by insulating layer with openings, then electrical connection is achieved, but contact area between conductive layers is reduced
Solution Approach 1:
The patent applies local quality by creating regions with different functional properties: opening regions with high conductivity for electrical connection and partition regions with mechanical strength for peeling prevention. The contact area is strategically optimized in the opening regions where electrical connection is needed, while the partition regions provide structural support without requiring electrical contact. This localized functional differentiation allows the structure to achieve both electrical connectivity and mechanical integrity.
Data Source
AI summary
An electronic device is provided. The electronic device includes a substrate including an active region and a border region adjacent to the active region. The electronic device includes a plurality of pixels disposed in the active region. The electronic device includes a conductive structure disposed in the border region and including a first conductive layer, a second conductive layer, and a third conductive layer disposed between the first conductive layer and the second conductive layer, wherein the third conductive layer overlaps with a part of the first conductive layer and overlaps a part of the second conductive layer. The electronic device includes an insulating layer disposed between the first conductive layer and the second conductive layer, and the insulating layer has a first opening and a second opening through which the first conductive layer and the second conductive layer are electrically connected with each other.