Conductive Pad Connection Structure to Prevent Layer Peeling
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Solution Overview
Problem
The peeling problem of conductive pads in connection structures affects the electrical conductivity and yield of electronic devices, as the bondability of different material layers is compromised.
Innovation Solution
A connection structure is designed with a first conductive pad, a first insulating layer with a through-hole, a second conductive pad electrically connected to the first through the hole, a second insulating layer with a through-hole and a recessed portion overlapping the first through-hole, and a third conductive pad extending on the surface of the recessed portion, enhancing contact area and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple layers of materials are stacked to form connection structures, then electrical conductivity is improved, but bondability between layers deteriorates causing peeling problems
Solution Approach 1:
The patent introduces a recessed portion in the second insulating layer that overlaps with the first through-hole, creating a three-dimensional overlapping structure. This dimensional change increases the contact area between conductive pads across different layers, improving both electrical conductivity and bondability simultaneously by adding spatial overlap rather than simply increasing layer thickness.
Solution Approach 2:
The recessed portion of the second insulating layer is positioned to overlap and nest with the first through-hole, creating a nested configuration where conductive pads from different layers overlap in the vertical direction. This nesting approach enhances inter-layer bonding while maintaining electrical connectivity through the overlapping conductive regions.
2Strength
If contact area between conductive pads is increased, then adhesion is improved, but structural complexity increases
Solution Approach 1:
The patent segments the second insulating layer by creating a localized recessed portion rather than modifying the entire layer structure. This segmentation approach increases adhesion only at critical overlapping regions while keeping the rest of the multi-layer structure simple and manageable, thus improving adhesion without proportionally increasing overall structural complexity.
Data Source
AI summary
A connection structure is provided. The connection structure includes a first conductive pad, a first insulating layer, a second conductive pad, a second insulating layer, and a third conductive pad. The first insulating layer is disposed on the first conductive pad and includes a first through-hole. The second conductive pad is disposed on the first insulating layer and electrically connected to the first conductive pad through the first through-hole. The second insulating layer is disposed on the second conductive pad and includes a second through-hole and a first recessed portion. The first recessed portion overlaps the first through-hole. The third conductive pad is disposed on the second insulating layer and electrically connected to the second conductive pad through the second through-hole. The third conductive pad extends on a surface of the first recessed portion.