Recessed Conductive Pad Layout for Stable Embedded Capacitors
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Solution Overview
Problem
The scaling down of semiconductor devices poses challenges in supporting structures, making it difficult to penetrate or punch through, which affects electrical characteristics and yield, and increases the need for additional supporting structures that can complicate capacitor design and manufacturing.
Innovation Solution
A semiconductor device design where a conductive pad has a recessed portion that supports the capacitor structure, eliminating the need for additional supporting structures and enhancing electrical stability by increasing the contact area between the capacitor and the pad.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If supporting structures (such as supporting beams or lattice films) are used to support the capacitor side, then the capacitor stability is improved, but the device complexity increases and manufacturing difficulty increases
Solution Approach 1:
The conductive pad is merged with the supporting function by forming a recessed portion that directly supports the capacitor structure. This eliminates the need for separate supporting structures (beams or lattice films), thereby reducing device complexity while maintaining capacitor stability. The conductive pad serves dual purposes: electrical connection and mechanical support.
Solution Approach 2:
The supporting function is extracted from separate supporting structures and integrated into the conductive pad itself through the recessed portion design. This removes the need for additional supporting components, simplifying the overall device structure while preserving the stabilizing effect.
2Reliability
If supporting structures are used to prevent short circuit or wobbling of the capacitor, then the electrical characteristics are improved, but the manufacturing precision requirements increase
Solution Approach 1:
The conductive pad combines electrical conduction and mechanical support functions in a single structure. The recessed portion provides inherent support that prevents capacitor wobbling and short circuits without requiring additional precision-manufactured supporting components, thereby reducing manufacturing precision requirements.
3Stability of the object's composition
If additional supporting structures are added to support the capacitor, then the capacitor stability is improved, but the ease of manufacture deteriorates
Solution Approach 1:
The conductive pad is designed with a recessed portion that integrates the supporting function into the existing electrical connection structure. This eliminates the need for separate supporting structures, simplifying the manufacturing process while maintaining capacitor stability.
4Reliability
If the conductive pad surface is recessed to define a recessed portion, then the contact area between capacitor and pad is increased, but the manufacturing complexity increases
Solution Approach 1:
The conductive pad features a localized recessed portion only where needed to support the capacitor structure and increase contact area. This local modification rather than global structural change minimizes added complexity while achieving the desired electrical stability improvement.
Data Source
AI summary
A semiconductor device and a method of manufacturing a semiconductor device are provided. The semiconductor device includes a substrate and a conductive pad disposed on the substrate and having a first surface facing away from the substrate. The first surface of the conductive pad is recessed toward the substrate and defines a recessed portion. The semiconductor device also includes a capacitor structure at least partially-disposed within the recessed portion of the conductive pad and electrically connected with the substrate through the conductive pad.