Low-Temperature Conductive Paint for Adhesive Shield Layers
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Solution Overview
Problem
Conductive paints used for forming shield layers on electronic components and resin molded articles face challenges with high curing temperatures, which can damage components and result in insufficient shielding characteristics and adhesion, especially when applied to resin molded articles with a heatproof temperature of 110° C. or less.
Innovation Solution
A conductive paint composition comprising 100 parts by mass of a binder component with epoxy resin, 1,000 to 4,000 parts by mass of metal particles, 50 to 150 parts by mass of a blocked isocyanate curing agent, and 200 to 1,500 parts by mass of solvent, which can be cured at 90 to 110° C., providing excellent conductivity and adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional conductive paint is used to form shield layer, then shielding characteristics are achieved, but curing temperature is too high causing damage to electronic components
Solution Approach 1:
The patent modifies the chemical composition parameters of the conductive paint by incorporating specific low-melting-point metals (Bi, In, Zn) and adjusting the metal particle composition to enable curing at temperatures between 50-150°C, thus resolving the contradiction between achieving shielding characteristics and avoiding high curing temperatures that damage electronic components
Solution Approach 2:
The patent creates a composite conductive paint formulation combining epoxy resin with low-melting-point metal particles (Bi, In, Zn) and conductive metal powder, which enables the shield layer to achieve both shielding effectiveness and low-temperature curability through the synergistic effect of different materials
2Reliability
If conventional conductive paint is used, then conductivity is achieved, but adhesion to resin molded articles is insufficient
Solution Approach 1:
The patent adjusts the chemical composition parameters by incorporating silane coupling agents and optimizing the ratio of metal particles to binder, enabling the conductive paint to achieve both excellent conductivity and strong adhesion to resin molded articles through enhanced chemical bonding at the interface
3Reliability
If metal particles content is increased to improve conductivity, then shielding characteristics improve, but viscosity increases making application difficult
Solution Approach 1:
The patent optimizes the particle size distribution and aspect ratio of metal particles, and adjusts the solvent content and viscosity modifiers in the formulation, enabling high metal particle content (50-90 wt%) to be achieved while maintaining manageable viscosity for easy application through spray, brush, or dip methods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive paint achieves effective curing at low temperatures, preventing damage to electronic components and ensuring excellent conductivity and adhesion, thereby forming a reliable shield layer on both electronic components and resin molded articles.
Implementation Method 1
a conductive paint composition comprising 100 parts by mass of a binder component with epoxy resin, 1,000 to 4,000 parts by mass of metal particles, 50 to 150 parts by mass of a blocked isocyanate curing agent, and 200 to 1,500 parts by mass of solvent, which can be cured at 90 to 110° C.
Implementation Method 2
1,000 to 4,000 parts by mass of metal particles
Data Source
AI summary
Provided is a conductive paint that can be cured at a temperature of 110° C. or less and has both excellent conductivity and adhesiveness. The conductive paint includes, per 100 parts by mass of a binder component (A) containing an epoxy resin, 1,000 to 4,000 parts by mass of metal particles (B), 50 to 150 parts by mass of a blocked isocyanate curing agent (C), and 200 to 1,500 parts by mass of a solvent (D).