Conductive Particle Alignment for Anisotropic Film Manufacturing
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Solution Overview
Problem
The miniaturization of connecting terminals and narrowing of terminal intervals in high-density electronic component mounting lead to issues with electrically conductive particles causing short circuits due to random dispersion in anisotropic conductive films, which existing methods fail to completely prevent.
Innovation Solution
A method involving the alignment of electrically conductive particles on a wiring board in a predetermined array pattern, followed by transferring them to a binder resin layer on a transfer film, ensuring precise placement and dispersion to prevent short circuits between terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electrically conductive particles are randomly dispersed in the binder resin, then the manufacturing process is simple, but short circuits occur between microminiaturized terminals
Solution Approach 1:
The patent applies preliminary action by pre-aligning electrically conductive particles into a predetermined array pattern on a temporary substrate before transferring them to the binder resin layer. This advance arrangement ensures particles are properly positioned before the bonding process, preventing short circuits while maintaining manufacturing efficiency.
Solution Approach 2:
The patent uses a temporary substrate as an intermediary carrier to hold and align the electrically conductive particles in a predetermined pattern. This intermediary allows particles to be arranged precisely before transfer to the final product, resolving the conflict between simple manufacturing and reliable short circuit prevention.
2Area of moving object
If connecting terminals are microminiaturized for high density mounting, then the device size is reduced, but particle aggregation causes short circuits
Solution Approach 1:
The patent applies local quality by creating a predetermined array pattern where particles are locally positioned at specific intervals corresponding to individual terminal locations. This localized precision arrangement ensures particles are present where needed for conduction but isolated from adjacent terminals, preventing short circuits in microminiaturized devices.
Solution Approach 2:
The patent uses preliminary action to pre-arrange particles in a predetermined array pattern on a temporary substrate before transfer. This advance positioning ensures proper particle distribution for microminiaturized terminals, preventing aggregation and short circuits while enabling high density mounting.
3Reliability
If electrically conductive particles are aligned in a predetermined array pattern, then short circuits are prevented, but the manufacturing process becomes complex
Solution Approach 1:
The patent uses a temporary substrate as an intermediary to simplify the alignment process. Particles are arranged in a predetermined pattern on this temporary carrier, which then transfers the pre-arranged particles to the binder resin layer. This intermediary approach maintains reliability while managing manufacturing complexity.
Solution Approach 2:
The patent applies preliminary action by pre-aligning particles on a temporary substrate before the final bonding process. This advance arrangement separates the alignment step from the bonding step, allowing complex particle positioning to be performed independently and then transferred as a complete pattern, reducing overall process complexity.
4Reliability
If particle size is decreased for better dispersion, then short circuits are reduced, but particle capture rate on terminals decreases
Solution Approach 1:
The patent uses preliminary action to pre-position particles in a predetermined array pattern on a temporary substrate before transfer. This advance arrangement ensures that even small particles are precisely positioned at target locations, maintaining high capture rates on terminals while preventing short circuits through proper spacing.
Solution Approach 2:
The patent applies local quality by creating a predetermined array pattern where each particle is locally positioned at specific coordinates corresponding to terminal locations. This localized precision ensures small particles are captured efficiently on terminals while maintaining adequate spacing to prevent short circuits between adjacent terminals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures that electrically conductive particles are evenly distributed and securely captured on microminiaturized terminals, effectively preventing short circuits and meeting the requirements of high-density mounting while maintaining low conduction resistance.
Implementation Method 1
charging the electrically conductive particles, and aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board
Implementation Method 2
bonding a transfer film having an adhesive layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer
Implementation Method 3
the substrates 51 and 54 are heat-pressurized from the top of the flexible substrate 51 by a heating and pressing head 56. By virtue of this, as illustrated in FIG. 12(B), the binder resin becomes fluid
Implementation Method 4
the connecting terminal 52 of the flexible substrate 51 and the connecting terminal 55 of the rigid substrate 54 are electrically connected to each other via the electrically conductive particles
Data Source
AI summary
A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer.