Conductive Particle Interconnects for Compact Electronics Assembly
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Solution Overview
Problem
Current electronics manufacturing methods face challenges in achieving compact designs with reduced distances between electrical contacts and components, particularly in mobile communications technology, where smaller dimensions are desired.
Innovation Solution
The use of electrically conductive particles, such as rod-shaped nanoparticles, that form agglomerates to connect and bind with electrical contacts via physical or chemical properties, eliminating the need for conventional joining technologies like soldering or adhesive bonding, and allowing for self-alignment and functionalization to enhance bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional joining technologies (soldering, adhesive bonding, ultrasonic welding) are used to connect chips to substrates, then reliable electrical connections are achieved, but the distance between chip and substrate cannot be reduced below certain limits and device size is increased
Solution Approach 1:
The patent replaces conventional mechanical joining technologies (soldering, adhesive bonding, ultrasonic welding) with a field-based approach using electromagnetic fields to levitate and position conductive particles. This substitution eliminates the need for physical contact and thermal processes, enabling sub-100μm spacing while maintaining connection reliability through field-controlled particle positioning and aggregation.
Solution Approach 2:
The patent changes the physical state and positioning parameters of conductive particles by applying electromagnetic fields. The particles are levitated, positioned, and aggregated at precise locations between chip and substrate using controllable electromagnetic parameters (frequency, amplitude, distribution), enabling dynamic adjustment of connection geometry and achieving distances impossible with conventional fixed joining methods.
2Manufacturing precision
If BGA technology with solder balls is used to achieve small dimensions between chip and substrate, then circuit density is improved, but further reduction in size is limited by the minimum achievable bump size
Solution Approach 1:
The patent segments the conductive connection into discrete conductive particles instead of using continuous solder balls. This segmentation allows individual particles to be independently positioned and aggregated at precise locations using electromagnetic fields, achieving finer spatial resolution than conventional BGA solder balls while simplifying the manufacturing process by eliminating complex reflow soldering operations.
Solution Approach 2:
The patent replaces the mechanical solder ball formation and placement process with electromagnetic field-based particle manipulation. This substitution eliminates the need for precise mechanical alignment and thermal processing, enabling greater manufacturing precision through field-controlled particle positioning while reducing overall manufacturing complexity.
3Ease of manufacture
If larger solder balls are used in BGA technology, then manufacturing is easier, but the distance between contacts and overall device size increases
Solution Approach 1:
The patent replaces mechanical solder ball placement with electromagnetic field-based particle aggregation. This substitution allows conductive particles to be automatically positioned and clustered at target locations through field gradients, achieving fine contact spacing without requiring precise mechanical placement equipment or large solder balls, thereby maintaining ease of manufacture while reducing device dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a more compact electronics unit with reduced distances between contacts, increased circuit density, and improved electrical connections, while maintaining mechanical integrity and reducing the size of the electronics unit.
Implementation Method 1
an electrically conductive structure comprising a plurality of electrically conductive particles which form an agglomerate due to their physical or chemical properties
Implementation Method 2
particles which form an agglomerate due to their physical or chemical properties and connect bind to the first and second electrical contacts
Implementation Method 3
particles which form an agglomerate due to their physical or chemical properties and connect bind to the first and second electrical contacts
Implementation Method 4
the particles are rod-shaped nanoparticles. In this case, the conductive structure comprises a plurality of nanoparticles aligned in parallel in a predetermined direction
Implementation Method 5
a plurality of nanoparticles aligned in parallel in a predetermined direction, which can be in contact with each other
Implementation Method 6
The particles and/or electrical contacts can, for example, be provided with at least one functional group and/or be functionalized so that the particles preferably bond with the electrical contacts, for example by weak interaction
Data Source
AI summary
A manufacturing method can be used to produce an electronics unit. The electronics unit contains a first component with a plurality of first electrical contacts, containing an integrated circuit, and a second component with a plurality of second electrical contacts. The first electrical contacts and the second electrical contacts are each electrically connected to each other via an electrically conductive structure containing a plurality of electrically conductive particles.