Conductive Particle Connection Structure for Fine-Pitch Socket Reliability
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Solution Overview
Problem
Conventional sockets using metal terminals face challenges in processing fine metal pins with increasing pin count and narrower pitch, leading to connection failures due to reduced strength and bending or breaking during CPU connection.
Innovation Solution
The use of specific conductive particles with a base particle and a conductive portion on its surface, having a particle diameter of 30 μm or more, and designed to maintain low resistance and withstand compression deformation without cracking, effectively replacing traditional metal terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of metal terminals is increased and pitch is narrowed to improve processing capacity, then information processing speed is improved, but the metal terminals become more prone to breaking and bending
Solution Approach 1:
The invention changes the material parameters of the terminal from conventional metal to a composite structure consisting of a resin bump with a conductor film. This parameter change allows the terminal to maintain mechanical strength while achieving smaller size and lower profile, thereby improving both productivity (through increased pin count and narrower pitch) and reliability (by preventing breakage and bending)
Solution Approach 2:
The invention uses a composite structure combining resin and conductor materials. The resin bump provides mechanical strength and structural support, while the conductor film provides electrical conductivity. This composite approach resolves the contradiction by enabling terminals to be both mechanically robust and electrically functional, allowing higher density connections without sacrificing reliability
2Productivity
If the metal terminal is miniaturized to increase pin count, then productivity is improved, but the strength of the metal terminal decreases
Solution Approach 1:
The invention fundamentally changes the size and structural parameters of the terminal by replacing the metal pin structure with a resin bump structure. The resin bump can be formed with precise dimensions and maintains strength at smaller sizes, enabling increased pin count while preserving mechanical strength through the conductor film reinforcement
3Device complexity
If conventional metal terminals are used to achieve narrow pitch, then device complexity is reduced, but connection failure occurs due to breaking and bending
Solution Approach 1:
The invention applies a conductor film on the outer surface of the resin bump to create a composite structure that maintains electrical conductivity while benefiting from the resin's mechanical properties. This composite approach enables narrow pitch connections without the breaking and bending issues of metal terminals, improving reliability while keeping the socket structure relatively simple
Data Source
AI summary
A conductive particle including a base particle and a conductive portion disposed on a surface of the base particle, in which a particle diameter of the conductive particle is 30 μm or more, and a ratio of a resistance value (R20) of the conductive particle after loading and unloading up to 20% compression deformation of the conductive particle are repeated 20 times to a resistance value (R1) of the conductive particle after loading and unloading up to 20% compression deformation of the conductive particle are performed once is 1.5 or less.